Ex Parte Yang et alDownload PDFPatent Trial and Appeal BoardJun 15, 201613383634 (P.T.A.B. Jun. 15, 2016) Copy Citation UNITED STA TES p A TENT AND TRADEMARK OFFICE APPLICATION NO. FILING DATE FIRST NAMED INVENTOR 13/383,634 01112/2012 Jianhua Yang 56436 7590 06/17/2016 Hewlett Packard Enterprise 3404 E. Harmony Road Mail Stop 79 Fort Collins, CO 80528 UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www .uspto.gov ATTORNEY DOCKET NO. CONFIRMATION NO. 82924182 1319 EXAMINER AHMED, SHARED ART UNIT PAPER NUMBER 2823 NOTIFICATION DATE DELIVERY MODE 06/17/2016 ELECTRONIC Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the following e-mail address( es): hpe.ip.mail@hpe.com mkraft@hpe.com chris.mania@hpe.com PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD Ex parte JIANHUA YANG, JOHN PAUL STRACHAN, MATTHEW D. PICKETT, and R. STANLEY WILLIAMS Appeal2014-009879 Application 13/383,634 Technology Center 2800 Before MAHSHID D. SAADAT, JOHNNY A. KUMAR, and JON M. JURGOV AN, Administrative Patent Judges. KUMAR, Administrative Patent Judge. DECISION ON APPEAL Appellants 1 appeal under 35 U.S.C. § 134(a) from the Final Rejection of claims 1-13, 16, and 17. 2 We have jurisdiction under35 U.S.C. § 6(b). We AFFIRM. 1 According to Appellants, the real party in interest is Hewlett-Packard Development Co., LP (App. Br. 3). 2 Claims 14 and 15 were canceled. Appeal2014-009879 Application 13/383,634 STATEMENT OF THE CASE Introduction Appellants' invention relates to a memristor with controlled electrode grain size (Spec. Title). Exemplary claim 1 under appeal reads as follows: 1. A memristor with a controlled electrode grain size, said memristor comprising: an adhesion layer; a first electrode having a first surface contacting the adhesion layer and a second surface opposite the first surface, wherein the first electrode is formed of an alloy of a base material and at least one second material, wherein the alloy has a relatively smaller grain size than a grain size of the base material; a switching layer positioned adjacent to the second surface of the first electrode; and a second electrode positioned adjacent to the switching layer. The Examiner's Rejection Claims 1-13, 16, and 17 are rejected under 35 U.S.C. § 103(a) as being unpatentable over Xia (US 8,093,575 B2; Jan. 10, 2012) and Rodriguez (US 2010/0055570 Al; Mar. 4, 2010) (Final Act. 4--10). Appellants ' Contentions 1. Appellants contend the Examiner erred in rejecting independent claim 1 over the combination of Xia and Rodriguez, because Rodriguez is non- analogous art to Xia's memristor device and the claimed subject matter (App. Br. 7-9; Reply Br. 4--5). Specifically, Appellants argue: 2 Appeal2014-009879 Application 13/383,634 Rodriguez describes a power source of an implantable device application, a bioelectric battery or biogalvanic cell for use as a power source in an implantable device, an implantable bioelectric battery, etc. See, e.g., Rodriguez, pars. [0004]- [0006], [0019]. Clearly, therefore, Rodriguez is not generally related to semiconductor devices. Instead, at best, Rodriguez is generally related to implantable devices and in particular to a bioelectric battery for implantable devices. App. Br. 8 2. Appellants contend the Examiner erred in rejecting claim 1 because the proposed modification of replacing the lower electrode of Xia with the magnesium alloy of Rodriguez would render Xia's memristor unsatisfactory for its intended purpose (App. Br. 9-11; Reply Br. 5-7). Appellants argue a lower electrode comprising the reactive consumable metal (i.e., magnesium alloy) of Rodriguez would react with the adhesion layer of Xia's memristor, preventing the adhesion layer from diffusing into the lower electrode, which is required for the memristor to fi.1nction as described by Xia (id.). 3. Appellants contend the Examiner's motivation to combine Xia and Rodriguez, using an alloy with a smaller grain size to reduce corrosion, is not sufficient to support the conclusion of obviousness (Reply Br. 4--7). Appellants argue Xia' s memristor is not a device that would be implanted, and thus is not likely to be subjected to the corrosion loss to which the electrode of Rodriguez would be subjected (Reply Br. 4--5). Appellants further contend the reduction in corrosion with smaller grain sizes only occurs in a particular type of magnesium alloy, which is not suitable for use in a memristor, and Rodriguez's teaching of a smaller grain size to reduce 3 Appeal2014-009879 Application 13/383,634 corrosion cannot be decoupled from the specific type of magnesium alloy (Reply Br. 5-7). 3 ANALYSIS We have reviewed the Examiner's rejections in light of Appellants' arguments (App. Br. 6-11; Reply Br. 4--7) that the Examiner erred. We disagree with Appellants' above contentions 1-3. We adopt as our own (1) the findings and reasons set forth by the Examiner in the action from which this appeal is taken (Final Act. 4--10) and (2) the reasons set forth by the Examiner in the Examiner's Answer (Ans. 3-5) in response to Appellants' Appeal Brief. We concur with the conclusions reached by the Examiner. We highlight and address specific findings and arguments for emphasis as follows. Appellants did not challenge the Examiner's factual findings with respect to Xia, and thus we take those findings as being conceded by Appellants. Regarding Appellants' contention 1 that Rodriguez is non-analogous art to Xia and the claimed subject matter, we are not persuaded of Examiner error in the rejection. "Whether a reference in the prior art is 'analogous' is a fact question." In re Clay, 966 F.2d 656, 658 (Fed. Cir. 1992) (citing Panduit Corp. v. Dennison Mfg. Co., 810 F.2d 1561, 1568 n. 9 (Fed. Cir. 1987)). Two criteria have evolved for answering the question: "(1) whether 3 Independent claims 9 and 13 are argued on the same basis as independent claim 1 (App. Br. 11 ), and separate patentability is not argued for dependent claims 2-8, 10-12, 16, and 17 (id.). Except for our ultimate decision, these claims are not discussed further. 4 Appeal2014-009879 Application 13/383,634 the art is from the same field of endeavor, regardless of the problem addressed, and (2) if the reference is not within the field of the inventor's endeavor, whether the reference still is reasonably pertinent to the particular problem with which the inventor is involved." Id. at 658-59 (citing In re Deminski, 796 F.2d 436, 442 (Fed. Cir. 1986); In re Wood, 599 F.2d 1032, 1036 (CCPA 1979)). Here, the Examiner cited Rodriguez to teach the concept of using an equal channel angular pressing (ECAP) treatment to produce an alloy with more uniform material microstructure and finer grain size (Ans. 3--4 (citing Rodriguez i-fi-127-29)). We agree with the Examiner's finding that, in the context of forming a metal alloy electrode of Xia (Final Act. 4--8 (citing Xia col. 5, 11. 16-22 and col. 8, 11. 26-32: electrodes formed of metal alloys and metal compounds, such as noble, less reactive platinum and palladium alloys)), Rodriguez's ECAP treatment that results in a more uniform alloy material micro structure would logically commend itself to an inventor's attention with regard to eiectrode iayers and, therefore, Rodriguez is properly combinable with Xia. As to Appellants' contention 2 that using Rodriguez's magnesium alloy as the lower electrode material of Xia would render Xia's memristor unsatisfactory for its intended purpose, we disagree with Appellants' contention because the Examiner's proffered combination does not replace the material of Xia's lower electrode with magnesium alloy (Final Act. 4--5; Ans. 3--4). Rather, the Examiner finds, and we agree, that it would have been obvious to one of ordinary skill in the art use Rodriguez's ECAP metal treatment process on the "relevant material composition" (e.g., less reactive platinum alloys) of Xia's lower electrode to form an alloy with a more 5 Appeal2014-009879 Application 13/383,634 uniform microstructure (id.). Thus, we do not find Appellants' contention persuasive of Examiner error. Regarding Appellants' contention 3 that the Examiner has not provided a proper motivation to combine Xia and Rodriguez, we are not persuaded of error because the Examiner has provided "some articulated reasoning with some rational underpinning to support the legal conclusion of obviousness" based on factual findings supported by the record (see Final Act. 4--5; Ans. 3-5). See KSR Int'! v. Teleflex, Inc., 550 U.S. 398, 418 (2007) (quoting In re Kahn, 441 F.3d 977, 988 (Fed. Cir. 2006)). While the memristor device resulting from the combination of Xia and Rodriguez may not necessarily be implanted and subjected to the same type of corrosion as discussed in Rodriguez, the electrodes of the device may still be subjected to corrosion from moisture, heat, etc., in the surrounding environment (see Xia's Fig. 2 and Appellants' Fig. 2, where the electrodes are exposed to the environment in those embodiments). Therefore, we agree with the Examiner's finding that an ordinary skilled artisan would recognize applying Rodriguez's well-known ECAP metal treatment to the metal alloy electrode material of Xia would yield an alloy with more uniform material distribution (id.), resulting in improved material characteristics (e.g., more uniform corrosion loss, more uniform resistivity, etc.) and improved service life of the electrode. Accordingly, we sustain the Examiner's rejection of independent claim 1. 6 Appeal2014-009879 Application 13/383,634 DECISION We affirm the decision of the Examiner to reject claims 1-13, 16, and 17 under 35 U.S.C. § 103(a). No time period for taking any subsequent action in connection with this appeal may be extended under 37 C.F.R. § 1.136(a)(l )(iv). AFFIRMED 7 Copy with citationCopy as parenthetical citation