Ex Parte Yajima et alDownload PDFPatent Trials and Appeals BoardFeb 28, 201913514411 - (D) (P.T.A.B. Feb. 28, 2019) Copy Citation UNITED STA TES p A TENT AND TRADEMARK OFFICE APPLICATION NO. FILING DATE 13/514,411 06/07/2012 23117 7590 03/04/2019 NIXON & V ANDERHYE, PC 901 NORTH GLEBE ROAD, 11 TH FLOOR ARLINGTON, VA 22203 FIRST NAMED INVENTOR Takeru Yajima UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www .uspto.gov ATTORNEY DOCKET NO. CONFIRMATION NO. GPK-427-275 7536 EXAMINER YOUNG, WILLIAM D ART UNIT PAPER NUMBER 1761 NOTIFICATION DATE DELIVERY MODE 03/04/2019 ELECTRONIC Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the following e-mail address(es): PTOMAIL@nixonvan.com pair_nixon@firsttofile.com PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD Ex parte T AKERU Y AJIMA, HIDETOSHI OHTA, and NORIHIRO NOSE Appeal2018-001213 Application 13/514,411 Technology Center 1700 Before BEYERL YA. FRANKLIN, GEORGE C. BEST, and LILAN REN, Administrative Patent Judges. BEST, Administrative Patent Judge. DECISION ON APPEAL The Examiner finally rejected claims 1, 2, 6, 8, 22, and 24--26 of Application 13/514,411 under 35 U.S.C. § 103(a) as obvious. Final Act. (October 3, 2016). Appellants 1 seek reversal of these rejections pursuant to 35 U.S.C. § 134(a). We have jurisdiction under 35 U.S.C. § 6. For the reasons set forth below, we reverse. 1 Taiyo Nippon Sanso Corp. is identified as the real party in interest. Appeal Br. 3. Appeal2018-001213 Application 13/514,411 BACKGROUND The '411 Application describes a composite resin material. Spec. ,r 1. In particular, the Specification describes a flooring-based resin that has been rendered conductive by adding a conductive nano-material to the resin. Id. ,I,I 3---6. Claim 1 is representative of the '411 Application's claims and is reproduced below from the Claims Appendix. 1. A composite resin material particle which is formed by a resin material particle that is a material for producing a resin molding product and a conductive nano-material, comprising: a resin-only region that is solely composed of a resin material of the resin material particle; and a dispersion mixing layer which is obtained by dispersedly mixing the conductive nano-material from a swface of the resin material particle to an inside of the resin material particle, wherein the resin-only region is present in the inside of the composite resin material particle and 60% or higher of a surface of the resin-only region is enclosed by the dispersion mixing layer, the dispersion mixing layer is formed over all of the surface or at least a part of the surface of the resin-only region, the conductive nano-material is dispersedly mixed within the resin material of the resin material particle in the dispersion mixing layer, the dispersion mixing layer forms a conductive layer, the mixed thickness of the dispersion mixing layer is from 0.1 µm to 1 µm, the conductive nano-material within the dispersion mixing layer has a shape with an outer diameter of 150 nm or smaller and a length of 500 nm or longer, 2 Appeal2018-001213 Application 13/514,411 the dispersion mixing layer includes a conductive net that is composed of the conductive nano-materials, the resin material is polytetrafluoroethylene, and the conductive nano-material is one or more selected from the group consisting of a carbon nanotube, a carbon nanofiber, a carbon nanocoil, a carbon nanotwist, a carbon nanohom, a metal nanoplate, a metal nanorod, and a metal nanowire. Appeal Br. 24--25 ( emphasis added). REJECTION On appeal, the Examiner maintains the following rejection: 1. Claims 1, 2, 6, 8, 22, and 24--26 are rejected under 35 U.S.C. § 103 (a) as unpatentable over the combination of Siegel, 2 Nakamura, 3 and Chen. 4 Final Act. 3. DISCUSSION The Examiner found that Siegel describes a composite resin particle comprising a fluoropolymer resin particle having carbon nanotubes embedded in its surface layer. Final Act. 3. The Examiner also found that Siegel's carbon nanotubes have an aspect ratio that overlaps with the range of aspect ratios set forth in claim 1. Id. The Examiner relies upon Nakamura to describe the thickness of the surface mixing layer. Id. The Examiner found that Nakamura describes a composite resin particle having a shell layer of conductive particles embedded in the resin material. Id. at 3- 2 US 2007/0199729 Al, published August 30, 2007. 3 US 5,403,873, issued April 4, 1995. 4 US 2007/0265379 Al, published November 15, 2007. 3 Appeal2018-001213 Application 13/514,411 4. The Examiner found that Nakamura's shell layer has a thickness between 0.01 µm up to 10 µm. Id. The Examiner relies upon Chen for teaching the use of PTFE as the fluoropolymer in Siegel's resin particle. Id. at 4. Claim 1, the only independent claim on appeal, requires the presence of "a dispersion mixing layer which is obtained by dispersedly mixing the conductive nano-material from a surface of the resin material particle to an inside of the resin material particle." As discussed above, the Examiner relies upon Nakamura as describing the thickness of the claimed dispersion mixing layer. Final Act. 3--4. This reliance is misplaced because Nakamura art does not describe a dispersion mixing layer. Rather, Nakamura describes resin particles coated with electrically conductive fine particles. See Nakamura Abstract, 3:37-50, 7:26-47. Nakamura describes its coating as being adhered to the resin particles, not mixed with the resin itself. Id. at 2:15-22. Accordingly, the Examiner erred by finding that Nakamura describes or suggests the recited dispersion mixing layer thickness. CONCLUSION For the reasons set forth above, we reverse the Examiner's rejection of claims 1, 2, 6, 8, 22, and 24--26. REVERSED 4 Copy with citationCopy as parenthetical citation