Ex Parte Richards et alDownload PDFBoard of Patent Appeals and InterferencesJan 23, 201211295105 (B.P.A.I. Jan. 23, 2012) Copy Citation UNITED STATES PATENT AND TRADEMARK OFFICE UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www.uspto.gov APPLICATION NO. FILING DATE FIRST NAMED INVENTOR ATTORNEY DOCKET NO. CONFIRMATION NO. 11/295,105 12/06/2005 William R. Richards JR. 4134-43 7788 20792 7590 01/23/2012 MYERS BIGEL SIBLEY & SAJOVEC PO BOX 37428 RALEIGH, NC 27627 EXAMINER LI, MEIYA ART UNIT PAPER NUMBER 2811 MAIL DATE DELIVERY MODE 01/23/2012 PAPER Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE ____________________ BEFORE THE BOARD OF PATENT APPEALS AND INTERFERENCES ____________________ Ex parte WILLIAM R. RICHARDS, JR. and MIKE YEN-CHAO SHEN ____________________ Appeal 2010-001398 Application 11/295,105 Technology Center 2800 ____________________ Before HOWARD B. BLANKENSHIP, JEAN R. HOMERE, and THU A. DANG, Administrative Patent Judges. DANG, Administrative Patent Judge. DECISION ON APPEAL Appeal 2010-001398 Application 11/295,105 2 I. STATEMENT OF THE CASE Appellants appeal under 35 U.S.C. § 134(a) from a Final Rejection of claims 1-16, 23, and 24 (App. Br. 2). Appellants are not appealing the Examiner’s rejections of claims 23 and 24, but note that these claims are pending (App. Br. 2). The Board has no jurisdiction as to non-appealed claims, and we consider claims 23 and 24 cancelled and not before us for review. The Examiner has the authority to cancel the non-appealed claims 23 and 24. See Ex parte Ghuman, 88 USPQ2d 1478, 1480 (BPAI 2008) (precedential). Claims 17-22 have been canceled (App. Br. 2). We have jurisdiction of claims 1-16 under 35 U.S.C. § 6(b). We affirm. A. INVENTION Appellants’ invention relates to a strained Silicon (Si)-on-Silicon- Germanium (SiGe) Fermi-Field Effect Transistor (FET) having dopings that realize ideal Fermi-FET characteristics, such as, a nearly zero electrical field in the gate insulator; wherein, the doping of the strained silicon channel, the doping of the substrate and/or the depth of the strained silicon channel are configured to produce nearly zero vertical electric field in the gate insulating layer and in the strained silicon channel surface at a threshold voltage of the field effect transistor (Abstract; Spec. 9:25-35) B. ILLUSTRATIVE CLAIM Claim 1 is exemplary: 1. A field effect transistor comprising: a strained silicon channel in a substrate; Appeal 2010-001398 Application 11/295,105 3 source/drain regions in the substrate at opposite ends of the strained silicon channel; a gate insulating layer on the strained silicon channel, wherein doping of the strained silicon channel, doping of the substrate and/or a depth of the strained silicon channel are configured to produce nearly zero vertical electric field in the gate insulating layer and in the strained silicon channel adjacent thereto at a threshold voltage of the field effect transistor; and a gate on the gate insulating layer that is configured to provide a gate work function that is close to a mid-bandgap of silicon. C. REJECTIONS The prior art relied upon by the Examiner in rejecting the claims on appeal is: Vinal US 5, 151, 759 Sept. 29, 1992 Bulucea US 5, 952, 701 Sept. 14, 1999 Murthy US 6, 373, 112 B1 Apr. 16, 2002 Isaacson US 2005/0280081 A1 Dec. 22, 2005 Claims 1-16 stand rejected under 35 U.S.C. 112, second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which Appellants regard as the invention. Claims 1-3, 5-12, and 14-16 stand rejected under 35 U.S.C. § 103(a) as being unpatentable over Isaacson in view of Vinal. Claims 4 and 13 stand rejected under 35 U.S.C. § 103(a) as being unpatentable over Isaacson in view of Vinal and Murthy. Appeal 2010-001398 Application 11/295,105 4 II. ISSUES The dispositive issues before us are whether the Examiner has erred in determining that: 1. the term “and/or” renders the claim indefinite for failing to particularly point out and distinctly claim the subject matter which Appellants regard as the invention(claim 1, emphasis added); and 2. the combination of Isaacson and Vinal would have taught or fairly suggested a field effect transistor comprising : a strained silicon channel in a substrate; . . . . a gate insulating layer on the strained silicon channel, wherein doping of the strained silicon channel, doping of the substrate and/or a depth of the strained silicon channel are configured to produce nearly zero vertical electric field in the gate insulating layer and in the strained silicon channel adjacent thereto at a threshold voltage of the field effect transistor. (Claim 1, emphasis added). III. FINDINGS OF FACT The following Findings of Fact (FF) are shown by a preponderance of the evidence. Isaacson 1. Isaacson discloses a transistor 1000 that “includes a gate contact 1051, source and drain contacts 1052, 1053, such as silicide contacts, a gate dielectric layer 1054, an unstrained silicon first layer 1010, an unstrained or strained SiGe intermediate layer 1030 bonded directly to the unstrained silicon layer 1010, and a tensilely strained silicon second layer Appeal 2010-001398 Application 11/295,105 5 1020 on the unstrained or strained SiGe intermediate layer 1030” which overlays an unstrained Si Substrate 1010 (Fig.10;¶[0109]); wherein, the gate dielectric 1054 is formed on the tensilely strained layer 1020 (¶[0114]). 2. The substrate may also incorporate buried insulating layers, in the manner of the Silicon-on-Insulator (SOI) wafer (¶ [0007]). Vinal 3. Vinal discloses a SOI FET having a gate insulating layer; wherein, at least one of the source doping, source depth, drain doping, drain depth, channel substrate doping, channel substrate depth, channel doping, and channel depth being selected to produce zero static electric field perpendicular to the surface between a channel substrate and the adjacent gate insulating layer (Abstract; col. 38, ll.17-26). IV. ANALYSIS Claims 1-16 The Examiner rejects claims 1-16 under 35 U.S.C. § 112, second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which Appellants regard as the invention, pertaining to the recitation in claim 1 of “doping of the strained silicon channel, doping of the substrate and/or a depth of the strained silicon channel” (Final Rej. 2, emphasis added). Appellants contend that “[t]he term ‘and/or’ is a well-defined logical construct” “to the extent that ‘or’ or ‘and/or’ is an alternative expression, such form of expression is expressly sanctioned by MPEP § 2173.01” (App. Br. 6). Appellants assert that “this term is widely used in claims and Appeal 2010-001398 Application 11/295,105 6 certainly is not indefinite, especially when the term is explicitly defined in the present specification” (id.). We agree with Appellants that the term “and/or” constitutes an alternative expression. In reaching this conclusion, we find the term “and/or” simply means that the recited elements before and after the term (i.e., the elements noted above) are optional. That is, the limitation merely recites alternatives which may or may not be present in the claimed invention—alternatives that ordinarily skilled artisans can readily ascertain. Reciting optional limitations does not, without more, render claims indefinite. See Ex parte Cordova, 10 USPQ2d 1949, 1950 (BPAI 1987) (“[T]he use of the alternative expression “optionally” in the rejected claims does not obfuscate the subject matter [A]ppellants regard as their invention”); Ex parte Wu, 10 USPQ2d 2031 (BPAI 1989) (finding no difficulty in determining the scope of a claim reciting composition consisting of three components and, optionally, a fourth component); Ex parte Schonauer, No. 2002-1992, 2002 WL 33950061, at *2 (BPAI Nov. 25, 2002) (non-precedential) (“The examiner has not explained, and it is not apparent, why the fact that the claims encompass methods in which the components following ‘optionally’ can be either present or absent renders the claims indefinite”). Accordingly, we conclude that claim 1 does reasonably apprise those skilled in the art of its scope. Because we conclude that there are no ambiguities with respect to claim 1 and thus claims 2-16 depending therefrom, we reverse the rejection of claims 1-16 under 35 U.S.C. § 112, second paragraph. Appeal 2010-001398 Application 11/295,105 7 Claims 1-3, 5-12, and 14-16 Appellants do not provide separate arguments with respect to independent claims 1, 8, and 11 (App. Br. 6). Appellants do not provide arguments with respect to dependent claims 2, 3, 5-7, 9, 10, 12, and 14-16 (id.). Accordingly, we select claim 1 as being representative of the claims. See 37 C.F.R. § 41.37(c)(1)(vii). Appellants contend that “Vinal relates to a Fermi-threshold silicon-on- insulator (SOI) field effect transistor,” and the “SOI technology [disclosed in Vinal] and strained silicon technology [disclosed in Isaacson] are not the same” (App. Br. 7). Appellants argue that “Isaacson explicitly teaches away from the use of SOI technology” because Issacson discloses that “an alternative to a Si1-xGex -based substrate, strained silicon can be provided on an oxide layer of a substrate;” yet, “[t]he presence of the oxide layer … forces process modifications” (App. Br. 9). Appellants argue that “there are unexpected results when combining a Fermi-FET design with a strained silicon channel” because “performance gains in regular transistors may be rather limited when using strained silicon;” yet, “[i]n contrast, a Fermi-FET may enjoy significantly more benefit from strained silicon technology” (App. Br. 10). However, the Examiner finds that Appellants’ first argument is not persuasive because “the Examiner relied on Vinal to teach only the nearly zero vertical electric field, not to teach the strained silicon technology or SOI technology” and “relied upon Issacson to teach the strained silicon technology” (Ans.11). The Examiner finds further that the disclosure in Isaacson “is not necessarily a teaching away from the use of SOI technology, especially since Issacson states that if the oxide is present, the process can App App still conc claim prior silico 1030 strain inter the t [002 eal 2010-0 lication 11 work with ludes that ed produc art,” App Figure 1 n first lay bonded d ed silicon mediate la ensilely str Isaacson Figure 1 3] and [01 01398 /295,105 some mod since App t exhibite ellants hav 0 of Isaacs er 1010, a irectly to t second la yer1030; w ained laye ’s Figure 0 depicts a 09]). ification” ellants “di d unexpec e not met on disclos n unstraine he unstrain yer 1020 o herein, a r 1020 (FF 10 is repro cross-sec 8 (Ans. 12) d not inclu ted proper their burd es a transi d or strain ed silicon n the unst gate dielec 1). duced belo tional diag . Finally, t de eviden ties compa en of proo stor 1000 ed SiGe i layer 101 rained or s tric layer w: ram of a t he Examin ce to show red with t f (Ans.13) having an ntermediat 0, and a te trained Si 1054 is fo ransistor 1 er that the hat of the . unstrained e layer nsilely Ge rmed on 000 (¶¶ Appeal 2010-001398 Application 11/295,105 9 We find that Issacson’s tensilely strained silicon second layer comprises a “strained silicon channel in a substrate” (claim 1). Further, we find that Issacson’s gate dielectric layer comprises a gate insulating layer that is formed overlaying the strained silicon channel (FF1). That is, we find that “a strained silicon channel in a substrate” and “a gate insulating layer on the strained silicon channel” (claim 1) reads on Issacson’s tensilely strained silicon second layer and gate dielectric layer, respectively. In addition, Vinal discloses a SOI FET having a gate insulating layer; wherein, the channel substrate doping, the channel substrate depth, the channel doping and the channel depth are selected to produce a zero static electric field perpendicular to the surface between a channel substrate and the adjacent gate insulating layer (FF 3). We find that Vinal’s selection of the channel substrate doping, the channel substrate depth, the channel doping and the channel depth to produce zero static electric field perpendicular to the surface between a channel substrate and the adjacent gate insulating layer to be “doping of the strained silicon channel, doping of the substrate and/or a depth of the strained silicon channel . . . to produce nearly zero vertical electric field in the gate insulating layer and in the strained silicon channel adjacent thereto at a threshold voltage of the field effect transistor” (claim 1). We agree with the Examiner’s finding that the Appellants’ argument that the “SOI technology [disclosed in Vinal] and strained silicon technology [disclosed in Isaacson] are not the same” (App. Br. 7) is non-persuasive, since “the Examiner relied on Vinal to teach only the nearly zero vertical electric field, not to teach the strained silicon technology or SOI technology” (Ans. 11). Appeal 2010-001398 Application 11/295,105 10 We find that the combination of Isaacson and Vinal would have suggested providing: a strained silicon channel in a substrate; . . . . a gate insulating layer on the strained silicon channel, wherein doping of the strained silicon channel, doping of the substrate and/or a depth of the strained silicon channel are configured to produce nearly zero vertical electric field in the gate insulating layer and in the strained silicon channel adjacent thereto at a threshold voltage of the field effect transistor; . . . as specifically required by claim 1. Though Appellants also contend that the combination “teaches away” (App. Br. 9), our reviewing court has held that “‘[a] reference may be said to teach away when a person of ordinary skill, upon [examining] the reference, would be discouraged from following the path set out in the reference, or would be led in a direction divergent from the path that was taken by the applicant.’” Para-Ordnance Mfg., Inc. v. SGS Importers Int’l., Inc., 73 F.3d 1085, 1090 (Fed. Cir. 1995) (quoting In re Gurley, 27 F.3d 551, 553 (Fed. Cir. 1994)). Appellants have identified no express support for a direction divergent from the claimed invention since the recitation from Isaacson presented by Appellants focuses upon the disadvantages of substituting an oxide layer for a relaxed Si-Ge buffer (App. Br. 9), and not the disadvantages of incorporation of buried insulating layers using SOI technology. Further, Issacson discloses that the substrate may also incorporate buried insulating layers, in the manner of an SOI wafer (FF 2). Here, the Appellants appear to have viewed the reference from a different perspective than the Examiner. The issue here is not whether Isaacson Appeal 2010-001398 Application 11/295,105 11 teaches SOI technology but rather whether a person of ordinary skill, upon reading Isaacson, would be discouraged from using the step of selecting the channel doping, substrate doping, or channel depth to produce a zero static electric field perpendicular to the surface between a channel substrate and the adjacent gate insulating layer as taught by Vinal. Regarding the Appellants’ argument that the results are unexpected, our reviewing court has held that “[o]ne way for a patent applicant to rebut a prima facie case of obviousness is to make a showing of ‘unexpected results,’ i.e., to show that the claimed invention exhibits some superior property or advantage that person of ordinary skill in the relevant art would have found surprising or unexpected.” In re Soni, 54 F.3d 746, 750 (Fed. Cir. 1995). In In re Dillon, 919 F.2d 688, 696 (Fed. Cir. 1990), the Federal Circuit noted: In brief, the cases establish that if an [E]xaminer considers that he has found prior art close enough to the claimed invention to give one skilled in the relevant chemical art the motivation to make close relatives . . . of the prior art compound(s), then there arises what has been called a presumption of obviousness or a prima facie case of obviousness. In re Henze, 181 F.2d 196, 37 CCPA 1009, 85 USPQ 261 (CCPA 1950); In re Hass, 141 F.2d 122, 127, 130, 31 CCPA 895, 60 USPQ 544, 548, 552 (CCPA 1944). The burden then shifts to the A]pplicant, who then can present arguments and/or data to show that what appears to be obvious, is not in fact that, when the invention is looked at as a whole. In re Papesch, 315 F.2d 381, 50 CCPA 1084, 137 USPQ 43 (CCPA 1963). We have reviewed the record and agree with the Examiner’s finding that Appellants have not provided evidence of the unexpected results. Appeal 2010-001398 Application 11/295,105 12 Further, Appellants argue that the Specification discloses that strained-Si mobility enhancement is more beneficial in the Fermi-FET as opposed to n and p-channel MOSFET devices, since higher dopings are used for these MOSFET devices and lighter dopings are typically used in Fermi-FETs (Spec. 13, l. 22- 14, l. 13). However, this recitation does not support an unexpected result, since it merely discloses that the effects of strained-Si mobility enhancement on Fermi-FETs as opposed to MOSFET devices differ which would be expected. Moreover, this recitation serves to support an expected result of strained-Si mobility enhancement in a Fermi-FET, since a lighter doping should exhibit a greater degree of relative hole mobility enhancement for p-channel Fermi-FETs. Therefore, we find that the presumption of unpatentability is not overcome. The Supreme Court has stated that “[t]he combination of familiar elements according to known methods is likely to be obvious when it does no more than yield predictable results.” KSR Int’l Co. v. Teleflex Inc., 550 U.S. 398, 416 (2007). Thus, we find no error in the Examiner’s finding that the combination of Isaacson’s transistor (gate insulating layer on top of a strained silicon channel within a substrate) with channel/substrate doping and channel depth selection step for zero static electric field perpendicular to the surface between a channel substrate and the adjacent gate insulating layer, as disclosed in Vinal, produces zero vertical electric field in the gate insulating layer and in the strained silicon channel which would be obvious (Ans. 5; FF1 and 3). Accordingly, we find that Appellants have not shown that the Examiner erred in rejecting claim 1 under 35 U.S.C. § 103(a) over Issacson Appeal 2010-001398 Application 11/295,105 13 in view of Vinal; and independent claims 8 and 11 and claims 2, 3, 5-7, 9, 10, 12, and 14-16 depending from claims 1, 8, and 11 which have been grouped therewith. Claims 4 and 13 Appellants argue that claims 4 and 13 is patentable over the cited prior art for the same reasons asserted with respect to claim 1 (App. Br. 11). As noted supra, however, we find that the combination of Isaacson and Vinal discloses all the features of claim 1. We therefore affirm the Examiner’s rejection of claims 4 and 13 under 35 U.S.C. § 103 for the same reasons expressed with respect to parent claims 1 and 11, supra. V. CONCLUSION AND DECISION The Examiner’s rejection of claims 1-16 under 35 U.S.C. § 112, second paragraph is reversed. However, the Examiner’s rejection of claims 1-16 under 35 U.S.C. § 103(a) is affirmed. Because we have affirmed at least one ground of rejection with respect to each claim on appeal, the Examiner’s decision is affirmed. See 37 C.F.R. § 41.50(a)(1). No time period for taking any subsequent action in connection with this appeal may be extended under 37 C.F.R. § 1.136(a)(1)(iv). AFFIRMED llw Copy with citationCopy as parenthetical citation