Ex Parte Podlaha et alDownload PDFBoard of Patent Appeals and InterferencesJun 15, 200910196764 (B.P.A.I. Jun. 15, 2009) Copy Citation UNITED STATES PATENT AND TRADEMARK OFFICE ____________ BEFORE THE BOARD OF PATENT APPEALS AND INTERFERENCES ____________ Ex parte ELIZABETH J. PODLAHA, MICHAEL C. MURPHY, and LAKSHMIKANTH NAMBURI ____________ Appeal 2009-000849 Application 10/196,764 Technology Center 1700 ____________ Decided:1 June 16, 2009 ____________ Before BRADLEY R. GARRIS, CATHERINE Q. TIMM, and KAREN M. HASTINGS, Administrative Patent Judges. GARRIS, Administrative Patent Judge. DECISION ON APPEAL 1 The two-month time period for filing an appeal or commencing a civil action, as recited in 37 C.F.R. § 1.304, begins to run from the Decided Date shown on this page of the decision. The time period does not run from the Mail Date (paper delivery) or Notification Date (electronic delivery). Appeal 2009-000849 Application 10/196,764 Appellants appeal under 35 U.S.C. § 134 from the Examiner’s decision rejecting claims 16-18 and 21-27. We have jurisdiction under 35 U.S.C. § 6. We AFFIRM for the reasons expressed in the Answer and below. Statement of the Case Appellants claim a process for making a metal alloy microstructure by depositing metals into a mold having a recessed depth of at least about 50 µm and having an aspect ratio greater than 1 via a pulsed electroplating technique, wherein the electroplating pulses have an on time that is sufficiently short, and a duty cycle that is sufficiently low, that the products of the electroplating reactions and the products of any side reactions do not accumulate in concentrations that are sufficiently high to substantially interfere with the electroplating of the desired alloy into the deep recesses[,] and wherein the duty cycle is less than about 0.2[,] and wherein the on time is greater than about 1 second (claim 16). Representative independent claim 16 reads as follows: 16. A process for making a metal alloy microstructure; wherein the alloy comprises two or more metals, at least one of which metals is selected from the group consisting of nickel, iron, tungsten, and cobalt; said process comprising the steps of: (a) supplying into a mold an aqueous solution comprising salts of the metals, wherein the shape of the mold is complementary to the shape of the microstructure to be made, and wherein the mold includes one or more deep recesses having a depth of at least about 50 µm, and having an aspect ratio greater than about 1; (b) depositing the metals from the aqueous solution into the mold by pulsed electroplating; wherein the electroplating pulses have an on 2 Appeal 2009-000849 Application 10/196,764 time that is sufficiently short, and a duty cycle that is sufficiently low, that the products of the electroplating reactions and the products of any side reactions do not accumulate in concentrations that are sufficiently high to substantially interfere with the electroplating of the desired alloy into the deep recesses; and wherein the duty cycle is less than about 0.2; and wherein the on time is greater than about 1 second; and wherein said depositing step is continued until a metal alloy microstructure has been formed having a height of at least about 50 µm, and having an aspect ratio greater than about 1. The references relied upon the Examiner as evidence of obviousness are set forth below: Yamashita 4,820,387 Apr. 11, 1989 Nee 4,869,971 Sep. 26, 1989 Dubin 5,972,192 Oct. 26, 1999 Taylor 6,524,461 B2 Feb. 25, 2003 Chen 6,776,891 B2 Aug. 17, 2004 N. H. Phan et al., Electrodeposition of Fe-Ni and Fe-Ni-Co Alloys, in 21 J. Appl. Electrochem. 672-677 (1991) (hereafter Phan). B. Löchel et al., Ultraviolet Depth Lithography and Galvanoforming for Micromachining, in 143 J. Electrochem. Soc. 237-244 (1996) (hereafter Löchel). V.K.P. Kanigicherla et al., Enhanced Adhesion of PMMA to Copper with Black Oxide for Electrodeposition of High Aspect Ratio Nickel-Iron Microstructures, in 4 Microsystem Technologies 77-81 (1998) (hereafter Kanigicheria2). W. Ehrfeld et al., Materials of LIGA Technology, in 5 Microsystem Technologies 105-112 (1999) (hereafter Ehrfeld). 2 The Examiner and Appellants refer to this reference by the misspelled name “Kanigicheria” and so shall we in order to be consistent with the record. 3 Appeal 2009-000849 Application 10/196,764 Under 35 U.S.C. § 103(a), the Examiner rejects: claims 16-18 and 21-25 over Ehrfeld in combination with Taylor and Dubin in view of Chen and Yamashita; claims 16-18, 21-23, and 25 over Löchel or Kanigicheria in combination with Taylor and Dubin in view of Chen and Yamashita; and claims 26 and 27 over the previously cited references and further in view of Phan and Nee respectively. The Examiner concludes that it would have been obvious for one with ordinary skill in this art to practice the metal deposition step in the respective processes of Löchel, Ehrfeld, and Kanigicheria with pulsed electroplating having a duty cycle less than about 0.2 and an on time greater than about 1 second as required by independent claim 16 so as to replenish depleted metal-to-be-deposited in view of Taylor, Dubin, Chen, and Yamashita (Ans. 7-9, 11, para. bridging 13-14). Because Appellants have not separately argued any of the dependent claims, all appealed claims will stand or fall with independent claim 16 (App. Br. 10; Supp. App. Br. 3). Issues Have Appellants shown error in the Examiner’s finding that Chen is analogous art? Have Appellants shown error in the Examiner’s finding that Taylor, Dubin, Chen, and Yamashita would have suggested practicing the metal deposition step of Löchel, Ehrfeld, and Kanigicheria with pulsed electroplating having a duty cycle less than about 0.2 and an on time greater than about 1 second as required by claim 16? 4 Appeal 2009-000849 Application 10/196,764 Findings of Fact In response to Appellants’ argument to the contrary, the Examiner finds that Chen is analogous art because it is in the field of Appellants’ endeavor and is reasonably pertinent to the particular problem with which Appellants were concerned (Ans. para. bridging 20-21, first full para. at 21). In this regard, the Examiner emphasizes the undisputed finding that Chen discloses a process for depositing metal (i.e., as a thin film) by pulsed electroplating in a high aspect ratio recess or trench (Ans. para. bridging 6-7, para. bridging 20-21). The Examiner also finds that [e]ach of the primary references, Löchel . . . , Ehrfeld . . . and Kanigicheria . . . , discloses a process for making a metal alloy microstructure by electrodeposition of a metal or alloy into a deep recess having a thickness of at least 50 µm and an aspect ratio greater than 1 (Ans. 15). The Examiner concedes that the metal deposition step of these primary reference processes is not practiced by pulsed electroplating with a duty cycle less than about 0.2 and an on time greater than about 1 second as required by claim 16 (Ans. para. bridging 4-5, first para. at 11, para. bridging 13-14). However, the Examiner finds that “the secondary references [to Taylor, Dubin, Chen, and Yamashita] show that the pulse plating values of duty cycle and on time recited in claim 16 are known and have been used in the art” to replenish metal-to-be-deposited (Ans. para. bridging 17-18, para. bridging 18-19). Appellants agree with these findings by the Examiner (Reply Br. 5). 5 Appeal 2009-000849 Application 10/196,764 Principles of Law A reference may serve as analogous art if it is from the field of the inventor’s endeavor or if it is reasonably pertinent to the problem addressed by the inventor. In re ICON Health and Fitness, Inc., 496 F.3d 1374, 1379- 80 (Fed. Cir. 2007). The combination of familiar elements according to known methods is likely to be obvious when it does no more than yield predicable results. KSR Int’l Co. v. Teleflex, Inc., 550 U.S. 398, 415-16 (2007). One of the ways in which claim subject matter can be proved obvious is by noting that there existed at the time of the invention a known problem for which there was an obvious solution encompassed by the claims. Id. at 419-20. The motivation in the prior art to combine references does not have to be identical to that of the applicant to establish obviousness. In re Kemps, 97 F.3d 1427, 1430 (Fed. Cir. 1996). Under § 103 obviousness, “‘it is not inventive to discover the optimum or workable ranges by routine experimentation’”. In re Geisler, 116 F.3d 1465, 1470 (Fed. Cir. 1997), quoting In re Aller, 220 F.2d 454, 456 (CCPA 1955). Analysis Appellants argue that Chen is not analogous art (App. Br. 24). According to Appellants, “even when Chen’s process is used to form within a high-aspect ratio trench, the resulting structure is itself still a thin film” (Id. at para. bridging 25-26). For several reasons, this argument does not reveal error in the Examiner’s finding that Chen is analogous art. 6 Appeal 2009-000849 Application 10/196,764 First, Appellants do not explain with any reasonable specificity why Chen does not satisfy the above-noted legal test for assessing whether a reference is analogous art. Similarly, Appellants do not explain why Chen’s process for depositing metal by pulsed electroplating into a high-aspect ratio trench is not within Appellants’ field of endeavor which likewise includes a process for depositing metal by pulsed electroplating into a high-aspect ratio recess. Stated differently, the argument under consideration does not clarify why the claimed and prior art processes should be considered in different fields of endeavor simply because the former process prolongs deposition to form a 50 µm high structure whereas the latter process limits deposition to form a thin film structure. Finally, Appellants do not explain why Chen’s process for pulsed electrodepositing metal into a high-aspect ratio trench is not reasonably pertinent to their general problem relating to pulsed electrodepositing metal into a high-aspect ratio recess. Appellants also argue that the applied references contain no teaching or suggestion of the claim 16 limitations “wherein the duty cycle is less than about 0.2” and “wherein the on time is greater than about 1 second” (App. Br. 12; Reply Br. 4-5). We cannot agree. As indicated earlier, Taylor, Dubin, Chen, and Yamashita evince that duty cycle values and on time values within the claim 16 ranges were individually known in the prior art as effective parameters for replenishing depleted metal-to-be-deposited. That is, these parameter values were individually known in the prior art as solutions to the recognized problem of replenishing the metal-to-be-deposited in electroplating processes of the type disclosed by the references applied against claim 16. Therefore, an artisan would have been motivated to employ these duty cycle and on time values of 7 Appeal 2009-000849 Application 10/196,764 the prior art in the metal depositing step of Löchel, Ehrfeld, or Kanigicheria in order to solve the metal replenishing problem known in the prior art. Although the duty cycle and on time values of Taylor, Dubin, Chen, and Yamashita were used individually rather than in combination, their individual use evinces that their combined use likewise would solve the metal replenishing problem known in the prior art. In other words, the individual use of these parameter values in the prior art supports a conclusion that it would have been obvious for an artisan to develop workable ranges for these parameters by routine experimentation, thereby yielding the combined duty cycle and on time values required by claim 16. Appellants emphasize that “[n]othing in any cited reference recognizes the source of the problem identified by the Applicants, namely, the buildup of reaction byproducts in deep recesses” (Reply Br. 7). While this may be so, claim subject matter can be proved obvious by showing there was a known problem for which there was an obvious solution encompassed by the claims. For this reason, the motivation in the prior art to combine references does not have to be identical to that of an applicant in order to establish obviousness. In this case, an artisan would have been motivated to combine the applied references in the proposed manner so as to solve the metal replenishing problem known in the prior art. In this last mentioned regard, Appellants argue that [t]he implicit, but unwarranted assumption is that optimizing the prior art pulsed electroplating process to replenish depleted reactants will also, of necessity, result in a process that is sufficiently slow to remove interfering byproducts from deep microrecesses as recited in Claim 16[,] [b]ut there is no reason why this should be so 8 Appeal 2009-000849 Application 10/196,764 (Reply Br. para. bridging 8-9). Contrary to this argument, a substantial reason exists for believing that duty cycle and on time values adequate to solve the metal replenishing problem known in the prior art also would have been adequate to solve the byproduct accumulation problem addressed by Appellants’ claim 16 process. This reason is the above-mentioned fact that duty cycle and on time values within Appellants’ claimed ranges were individually known in the prior art to solve the metal replenishing problem. As previously discussed, the combined use of these values, in accordance with claim 16, would have been expected to also solve this metal replenishing problem. Therefore, the Examiner’s proposed combination of applied references for the purpose of solving the metal replenishing problem known in the prior art would have yielded process steps fully corresponding to those defined by claim 16. Finally, Appellants argue that the above-cited KSR decision supports a conclusion that the claimed invention is non-obvious because it yields unpredictable results. (Reply Br. para. bridging 16-17). However, Appellants have proffered no evidence of unpredictable results in the record before us (see App. Br. 33, Evidence Appendix, “not applicable”). For all we know, based on the record of this appeal, the claim 16 process does not yield a metal alloy microstructure or any other tangible result which is unpredictably different from that of the applied references. Conclusions of Law Appellants have not shown error in the Examiner’s finding that Chen is analogous art. Appellants have not shown error in the Examiner’s finding that Taylor, Dubin, Chen, and Yamashita would have suggested practicing the 9 Appeal 2009-000849 Application 10/196,764 metal deposition step of Löchel, Ehrfeld, and Kanigicheria with pulsed electroplating having a duty cycle less than about 0.2 and an on time greater than about 1 second as required by claim 16. As a consequence, we sustain each of the § 103 rejections advanced by the Examiner in this appeal. Order The decision of the Examiner is affirmed. ssl PATENT DEPARTMENT TAYLOR, PORTER, BROOKS & PHILLIPS, L.L.P P.O. BOX 2471 BATON ROUGE, LA 70821-2471 10 Copy with citationCopy as parenthetical citation