Ex Parte Pearson et alDownload PDFPatent Trial and Appeal BoardSep 24, 201814507904 (P.T.A.B. Sep. 24, 2018) Copy Citation UNITED STA TES p A TENT AND TRADEMARK OFFICE APPLICATION NO. FILING DATE FIRST NAMED INVENTOR 14/507,904 10/07/2014 Matthew Robert Pearson 54549 7590 09/26/2018 CARLSON, GASKEY & OLDS/PRATT & WHITNEY 400 West Maple Road Suite 350 Birmingham, MI 48009 UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www .uspto.gov ATTORNEY DOCKET NO. PA22856US; 67097-2676PUS1 CONFIRMATION NO. 8679 EXAMINER THOMPSON, JASON N ART UNIT PAPER NUMBER 3744 NOTIFICATION DATE DELIVERY MODE 09/26/2018 ELECTRONIC Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the following e-mail address(es): ptodocket@cgolaw.com PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD Ex parte MATTHEW ROBERT PEARSON and NEAL R. HERRING 1 Appeal2018-001712 Application 14/507,904 Technology Center 3700 Before KEVIN F. TURNER, BRETT C. MARTIN, and ALYSSA A. FINAMORE, Administrative Patent Judges. MARTIN, Administrative Patent Judge. DECISION ON APPEAL STATEMENT OF CASE Appellants appeal under 35 U.S.C. § 134 from the Examiner's rejection of claims 1-15. We have jurisdiction under 35 U.S.C. § 6(b). We AFFIRM. THE INVENTION Appellants' claims are directed generally "to heat transfer interfaces, and more specifically to heat transfer interfaces for use in high temperature 1 Appellants identify United Technologies Corp. as the real party in interest. Appeal Br. 1. Appeal2018-001712 Application 14/507,904 applications." Spec. ,r 1. Claim 1, reproduced below, is illustrative of the claimed subject matter: 1. A thermal interface comprising: a first thermal component; a second thermal component; a fluid filled cushion disposed between said first thermal component and said second thermal component, and wherein the fluid filled cushion is a thermal joint. REFERENCES The prior art relied upon by the Examiner in rejecting the claims on appeal is: Gelorme2 Gelorme 3 Harttig US 2005/0061474 Al Mar. 24, 2005 US 2006/0157223 Al July 20, 2006 US 2010/0122807 Al May 20, 2010 REJECTIONS The Examiner made the following rejections: Claims 1--4 and 6-14 stand rejected under 35 U.S.C. § I03(a) as being unpatentable over Harttig and Gelorme '4 7 4. Final Act. 2---6. Claims 5 and 15 stand rejected under 35 U.S.C. § I03(a) as being unpatentable over Harttig, Gelorme '474, and Gelorme '223. Final Act. 6-7. ANALYSIS Appellants focus much of their argument against the Examiner's initial finding (Final Act. 2) that Harttig teaches a cushion, and therefore, it would be a mere simple substitution of the cushion of Gelorme '4 7 4 for the 2 Gelorme '474. 3 Gelorme '223 2 Appeal2018-001712 Application 14/507,904 cushion in Harttig. See, e.g., Reply Br. 1--4. According to Appellants, "[t]he examiner's assertion that the thermal interface layer [in Harttig] is a 'cushion' is complete speculation, and has no basis in the teachings of the reference. Id. at 3. The Examiner, however, in both the Final Action and the Answer, points to Harttig, paragraphs 37 and 38, which disclose that the thermal interface layer may be a pad, "where a pad is readable as a cushion." Ans. 3. Likewise, Gelorme '474 also explains that its cushion is a pad. Id. ,r 19. Accordingly, the Examiner's simple substitution rationale is sufficient given that both Harttig and Gelorme '4 7 4 teach the use of pads ( or cushions) and the Examiner is simply substituting the liquid filled pad/cushion of Gelorme '4 7 4 for Harttig' s pad/ cushion. The Examiner also points out that regardless of the exact meaning of the term "cushion" or its application in either of the references at issue, both Harttig and Gelorme '4 7 4 specifically refer to their interface layers as "thermal interface layers." Ans. 6. Gelorme '474 (i-f 3) describes that its cushion is an improvement over "a thin layer of thermally conductive paste disposed between opposing surfaces of the chip and the heat sink unit." As such, in addition to pads, both references teach the use of grease or paste as thermal interface layers such that one of skill in the art would understand that the cushion of Gelorme '474 is a suitable replacement for Harttig's grease. Accordingly, we are not persuaded of error in the Examiner's rejections. DECISION For the above reasons, we AFFIRM the Examiner's decision to reject claims 1-15. 3 Appeal2018-001712 Application 14/507,904 No time period for taking any subsequent action in connection with this appeal may be extended under 37 C.F.R. § 1.I36(a)(l)(iv). AFFIRMED 4 Copy with citationCopy as parenthetical citation