Ex Parte Obweger et alDownload PDFBoard of Patent Appeals and InterferencesJan 10, 201210560812 (B.P.A.I. Jan. 10, 2012) Copy Citation UNITED STATES PATENT AND TRADEMARK OFFICE ________________ BEFORE THE BOARD OF PATENT APPEALS AND INTERFERENCES ________________ Ex parte RAINER OBWEGER, Alexander Pfeuffer, Martin Koffler, and Alexander Lippert ________________ Appeal 2011-003028 Application 10/560,812 Technology Center 1700 ________________ Before ADRIENE LEPIANE HANLON, PETER F. KRATZ, and MARK NAGUMO, Administrative Patent Judges. NAGUMO, Administrative Patent Judge. DECISION ON APPEAL Appeal 2011-003028 Application 10/560,812 2 A. Introduction1, 2 Rainer Obweger, Alexander Pfeuffer, Martin Koffler, and Alexander Lippert (“Obweger”) timely appeal under 35 U.S.C. § 134(a) from the final rejection3 of claims 1, 2, 4-17, 22-25 and 27-31.4 We have jurisdiction. 35 U.S.C. § 6. We REVERSE, substantially for the reasons advanced by Obweger. The subject matter on appeal relates to an apparatus for the ultrasonic cleaning of wafers. The apparatus comprises holding means to hold a wafer substantially parallel between a lower plate and a closely spaced parallel upper plate. (Spec. 1-2, para. [007].) The lower plate is fitted with one or more vibrators (such as a piezoelectric transducer). (Id. at 2, para. [009].) A liquid is introduced into the gaps between the wafer and the upper and lower plates. (Id.) The lower plate transmits vibrational energy from the vibrators to the liquid, which in turn transmits the vibrational energy to the wafer. (Id. at para. [010].) Vibrational energy that is transmitted through the wafer is transmitted by the liquid in the upper gap to the upper plate. In 1 Application 10/560,812, Device and Method for Wet Treating Disc-Like Substrates, filed 15 December 2005 as the national stage of an international application filed 17 June 2004, and claiming the benefit of an application filed in Austria on 24 June 2003. The specification is cited as “Spec.” The real party in interest is listed as Lam Research AG. (Appeal Brief, filed 12 July 2010 (“Br.”), 1.) 2 Heard 5 January 2012. The Official Transcript, which was not available when this Opinion was entered, will be made of record. 3 Office action mailed 8 January 2010. 4 The remaining pending claims 18, 20, 21, 32-35 and 37 have been withdrawn from consideration. Appeal 2011-003028 Application 10/560,812 3 this way, interferences arising from reflected sound waves are said to be avoided. (Id. at para. [011].) In the embodiments of interest in this appeal, the plates may be rotated relative to one another. (Id. at 2, para. [014] through 3, para. [019].) The relative rotation is said to lead to equalize the intensity of the ultrasonic waves applied to the wafer. (Id. at 2, para. [012].) Claim 1 is representative, and reads: 1. A device for wet treatment of wafers, comprising: a first plate; a second plate substantially parallel to said first plate; holding means for holding a wafer between said first and said second plate substantially parallel to said plates; first dispensing means for introducing fluid into a first gap between said first plate and a wafer when being treated; second dispensing means for introducing fluid into a second gap between said second plate and a wafer when being treated; at least one vibrating element acoustically coupled to at least said second plate; and rotating means for rotating said holding means and said second plate relative to each other about an axis substantially perpendicular to said second plate. (Claims App., Br. 23; indentation and emphasis added.) Claim 6 reads: 6. The device according to claim 1, wherein said second plate of itself is not rotatable. (Claims App., Br. 24.) Appeal 2011-003028 Application 10/560,812 4 The Examiner maintains the following grounds of rejection:5 A. Claim 6 stands rejected under 35 U.S.C. § 112(2), as allegedly negating claim 1. B. Claims 1, 2, 4-11, 13, and 14 stand rejected under 35 U.S.C. § 103(a) in view of the combined teachings of Aegerter,6 Engesser,7 and Cavazza.8 C. Claim 12 stands rejected under 35 U.S.C. § 103(a) in view of the combined teachings of Aegerter, Engesser, Cavazza, and Azar.9 D. Claim 15 stands rejected under 35 U.S.C. § 103(a) in view of the combined teachings of Aegerter, Engesser, Cavazza, and Lawson10 E. Claim 16 stands rejected under 35 U.S.C. § 103(a) in view of the combined teachings of Aegerter, Engesser, Cavazza, and Donde.11 F. Claim 17 stands rejected under 35 U.S.C. § 103(a) in view of the combined teachings of Aegerter, Engesser, Cavazza, and Otsuki.12 5 Examiner’s Answer mailed 29 September 2010 (“Ans.”). 6 Brian K. Aegerter et al., Selective Treatment of Microelectronic Workpiece Surfaces, U.S. Patent 6,632,292 B1 (14 October 2003), based on an application filed 28 September 2000. 7 Philipp Engesser, U.S. Patent Application Publication 2002/0050244 A1 (2002). 8 Gilbert Cavazza, U.S. Patent Application Publication 2002/0162570 A1 (2002). 9 Lawrence Azar, U.S. Patent 6,890,390 B2 (2005), based on an application filed 23 May 2003. 10 Robert M. Lawson, U.S. Patent 4,401,131 (1983). 11 Arik Donde and Herzel Laor, U.S. Patent 5,788,453 (1998). 12 Masashi Otsuki et al., U.S. Patent 6,532,977 B2 (18 March 2003). Appeal 2011-003028 Application 10/560,812 5 G. Claims 22-24 and 27-30 stand rejected under 35 U.S.C. § 103(a) in view of the combined teachings of Aegerter, Engesser, Cavazza, Kim,13 and Azar. H. Claim 25 stands rejected under 35 U.S.C. § 103(a) in view of the combined teachings of Aegerter, Engesser, Cavazza, Kim, Azar, and Motoda.14 I. Claim 31 stands rejected under 35 U.S.C. § 103(a) in view of the combined teachings of Aegerter, Engesser, Cavazza, and Kim. B. Discussion Findings of fact throughout this Opinion are supported by a preponderance of the evidence of record. The final limitation of claim 1, which is also present in the other independent claim (claim 22), recites “rotating means for rotating said holding means and said second plate relative to each other about an axis substantially perpendicular to said second plate.” (Claims App., Br. 26; emphasis added). As indicated by the plain language of the claim, the rotation of the holding means, which holds a wafer, relative to the second plate, does not require that the second plate be rotatable. Thus, dependent claim 6, which requires that the second plate is not rotatable, is not inconsistent with claim 1. Accordingly, we REVERSE the rejection of claim 6 as indefinite. 13 Yong Bae Kim et al., U.S. Patent Application Publication 2004/0132318 A1 (8 July 2004), based on an application filed 4 January 2003. 14 Kimio Motoda and Kiyohisa Tateyama, U.S. Patent 5,762,708 (1998). App App desc moto by A Exam rotat p Insp supp eal 2011-0 lication 10 In the re ribes a wa r assembl ergerter at iner finds e relative t {Fig. 4 s ortion [11 ection of F orting the 03028 /560,812 maining re fer treating y 124, sho column 9 further th o the seco {A hows a cro 5], which r igure 4 an Examiner jections, t apparatus wn in Figu , line 62, t at this arra nd plate. ergerter F ss section otates the d the cited ’s finding 6 he Examin that comp re 4 (repro hrough co ngement p (Ans. 5, 1s igure 4 is of a wafe entire waf passage r of fact. Ra er finds th rises a ro duced be lumn 10, l ermits the t para., las shown be r housing er housing eveals no ther, work at Aergert tor 115 an low) and d ine 14. Th holding m t sentence low} [116] and and its co credible ev piece hou er d a rotor escribed e eans to .) rotor ntents} idence sing 116, Appeal 2011-003028 Application 10/560,812 7 which holds wafer 134, is attached to rotor portion 115 via support members 118, which engage radial flange 122 that extends from workpiece housing 116. Rotor motor 124 thus rotates the entire workpiece housing 116 about central axis 128. The Examiner has not explained how the means that hold the wafer are rotated relative to the second plate, which corresponds to lower chamber member 142. The Examiner does not rely on any of the remaining prior art references in any way that cures this defect. C. Order We REVERSE all the appealed rejections. REVERSED ssl Copy with citationCopy as parenthetical citation