Ex Parte Du Bois et alDownload PDFPatent Trial and Appeal BoardOct 4, 201812974365 (P.T.A.B. Oct. 4, 2018) Copy Citation UNITED STA TES p A TENT AND TRADEMARK OFFICE APPLICATION NO. FILING DATE FIRST NAMED INVENTOR 12/974,365 12/21/2010 Dale R. Du Bois 44257 7590 10/09/2018 PATTERSON & SHERIDAN, LLP- -Applied Materials 24 Greenway Plaza, Suite 1600 HOUSTON, TX 77046 UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www .uspto.gov ATTORNEY DOCKET NO. CONFIRMATION NO. 014019/USA/DSM/BCVD/AG 3583 EXAMINER ANTOLIN, STANISLAV ART UNIT PAPER NUMBER 1716 NOTIFICATION DATE DELIVERY MODE 10/09/2018 ELECTRONIC Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the following e-mail address(es): Pair_Eofficeaction@pattersonsheridan.com psdocketing@pattersonsheridan.com PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD Ex parte DALE R. DU BOIS, MOHAMAD A. AYOUB, ROBERT KIM, AMIT BANSAL, MARK FODOR, BINH NGUYEN, SIU F. CHENG, HANG YU, CHIU CHAN, GANESH BALASUBRAMANIAN, DEENESH P ADHI, and JUAN CARLOS ROCHA Appeal2017-005969 Application 12/974,365 Technology Center 1700 Before LINDA M. GAUDETTE, KAREN M. HASTINGS, and WESLEY B. DERRICK, Administrative Patent Judges. GAUDETTE, Administrative Patent Judge. DECISION ON APPEAL 1 Appellants2 appeal under 35 U.S.C. § 134(a) from the Examiner's decision finally rejecting claims 1-7, 9-12, 20, and 21. We have jurisdiction under 35 U.S.C. § 6(b). 1 This Decision includes citations to the following documents: Specification filed Dec. 21, 2010 ("Spec."); Final Office Action dated May 18, 2016 ("Final"); Advisory Action dated June 15, 2016 ("Advisory"); Appeal Brief filed Sept. 1, 2016 ("Appeal Br."); Examiner's Answer dated Dec. 9, 2016 ("Ans."); and Reply Brief filed Feb. 3, 2017 ("Reply Br."). 2 Appellants identify the real party in interest as Applied Materials, Inc. Appeal Br. 3. Appeal2017-005969 Application 12/974,365 We REVERSE. According to the Specification, "[a] primary goal of wafer processing is to obtain the largest useful surface area, and as a result the greatest number of chips, possible from each wafer." Spec. ,r 4. Non-uniform deposition at wafer edges reduces useful surface area. See id. ,r,r 4, 5. At the time of the invention, a known method of minimizing waste was to control deposition at wafer edges by using a shadow ring to mask or shield a portion of the wafer perimeter from process gases. Id. ,r 6. A disadvantage of using a shadow ring is that it can be difficult to align. Id. The invention "relate[ s] to shadow ring modifications that enhance or otherwise affect the deposition of process gases on the edge and bevel of a wafer." Id. ,r 2. Independent claim 1, reproduced below, is representative of the claimed invention. 1. A shadow ring for use in a deposition chamber, comprising: an annular body having a top surface and a bottom surface, the bottom surface including a first annular bottom surface and a second annular bottom surface, wherein the second annular bottom surface is disposed in a recessed slot located inwardly relative to the first annular bottom surface, the second annular bottom surface located a first distance above the first annular bottom surface; at least one pin member extending from the first annular bottom surface; and an annular lip extending inwardly relative to the recessed slot and the first annular bottom surface, wherein the annular lip has a third annular bottom surface located a second distance above the first annular bottom surface, the second distance less than the first distance, and wherein the recessed slot is formed between the pin member and the annular lip. Appeal Br. 13 (Claims Appendix). Independent claim 7, the only other independent claim on appeal, recites "[a] chamber for depositing a material on a 2 Appeal2017-005969 Application 12/974,365 wafer." Id. at 14. The chamber, as recited in claim 7, includes a shadow ring having features similar to those recited in claim 1, e.g., an annular lip, a recessed slot, a pin member, and first, second, and third annular bottom surfaces. Id. Appellants cite Figure 5 and corresponding disclosure in the Specification for a description of the shadow ring recited in claims 1 and 7. See Appeal Br. 5-6. Application Figure 5, as annotated by the Examiner on page 3 of the Advisory Action, is reproduced below. §:-...-:~, ~ /, ... ,,., .. ,,,~, ~~f' ~"l) ~:~x1 \ ·~ ) .,./· __ .... ··· .,······· ~ /, v','.',V ··r · .,,, .. ,,.,•.''.,_./'.,_ ............... ••" ·•w•<,:.:.it ..... ·. · ·· ·. · • • · j} ·:.·. . .·%.· .-······ .--- .... · . ~ ·--,~~, - .-~·· ,.:: .. --------------· .... ··· ,,, .. ,.,,· ..... -···.·:·.··.·.·'.~ ): ........... ······""""'"". ?'"' "'"' "'"' """ .,, ... --·;····< .· "'// / .... ····· ,·····'' .,····· ... / .· . ~, ''-"""'"'·' t I """'" i ··,,:: .... ,,// . ,. / .... ···::::::::;~<, .... 1¥ ·t \_ ti{* ~:~~ .......... ·,•' '.,. . . .~:. ,,•,•,•,•, < ,., ..• , ..• ,;:,···' ~ ~~~~-- ~ I I lt'ti ~nnulttif bottom 'SiMrt'~ iw;~~4~· ~~tt~trt ~~ ·1$.t >l*~~~~f ~tk® *mf~:e~ "Figure 5 is a schematic, partial, cross-sectional view of a shadow ring" (Spec. ,r 26), with annotations identifying an annular lip, a recessed slot, a pin member, and first, second, and third annular bottom surfaces (Advisory 4). According to the Specification, "[i]t has been found that the addition of the recessed slot 506 results in increased deposition at the bevel of the wafer W and increased film thickness at the edge of the wafer W." Spec. ,r 27. 3 Appeal2017-005969 Application 12/974,365 The Examiner relies on the following references as evidence of unpatentability: Yudovsky US 2004/0003780 Al Moslehi Sen Kaido US 6,907,924 B2 US 2005/0196971 Al US 2007 /0065597 Al Jan. 8,2004 June 21, 2005 Sept. 8, 2005 March 22, 2007 The claims stand finally rejected under 35 U.S.C. § I03(a) as follows: 1. claims 1, 2, 5, 6, and 20 over Sen in view ofMoslehi; 2. claim 3 over Sen in view ofMoslehi and Yudovsky; 3. claim 4 over Sen in view of Moslehi and Kaido; 4. claims 7, 9, 10, 12, and 21 over Sen in view ofMoslehi; and 5. claim 11 over Sen in view of Moslehi and Yudovsky. See Final 3-24. The Examiner relies primarily on the embodiment described in Sen Figures 8A-D for a teaching of a shadow ring as recited in claims 1 and 7. See Final 3---6, 14--16. The Examiner finds Sen does not disclose that the shadow ring in the embodiment of Figures 8A-D includes a recessed slot and does not describe the annular lip as having "a third annular bottom surface located a second distance above the first annular bottom surface, the second distance less than the first distance" as required by claims 1 and 7. Id. at 6, 16. The Examiner finds the shadow ring in the embodiment of Sen Figure 12A includes a recessed slot 980d. 3 Id. at 7, 18. The Examiner further finds Moslehi Figure 4 discloses a ring ( clamp 3 We agree with the Examiner that the numbering used in Sen Figures I2A-B is inconsistent with the numbering used in Sen ,r,r 136-138. Final 7. Like the Examiner, we refer to the numbering in Figures I2A-B in a manner consistent with the numbering in Figures 8A-D. 4 Appeal2017-005969 Application 12/974,365 96) for use in a deposition chamber that includes a recessed slot. Id. at 7-8, 18-19. Based on these teachings, the Examiner finds a motivation for modifying the annular body of the shadow ring of Sen[] to include a recessed slot and an annular lip as disclosed by Moslehi[] is to have a specific type of system configured to be capable of one or more of: ensuring a uniformity of the magnetic field at the edge regions of a wafer by incorporating one or more gaps in the form of one or more recessed slots in a shadow ring so as to be capable of depositing material uniformly in non-shadowed edge regions of the wafer; and allowing some physical contact between overhanging portions of a shadow ring and excluded edge regions of an underlying wafer while configuring the shadow ring so that any possible contamination not affect [sic] wafer yield. Id. at 8-9, 19-20. In the Advisory Action, however, the Examiner does not appear to rely on Moslehi for a teaching or suggestion of using a recessed slot and an annular lip, but cites only to Sen Figures 12A-B (see Advisory 6-9, e.g. id. at 9 ("[C]laim 1 is obvious in view of Sen[].")), contending the embodiment in these figures "discloses that gap characteristics ( e.g., shape, depth, width, breadth ... etc.) are result-effective variables" (id. at 7-8 (citing Sen ,r,r 133-138)). Appellants argue the Examiner reversibly erred in finding Sen, alone or in combination with Moslehi, discloses or suggests a shadow ring having a recessed slot and a second annular bottom surface located therein in the manner recited in claims 1 and 7. Appeal Br. 9-11. Appellants argue that in the embodiment of Figures 12A-B, Sen discloses a gap (980d), and a gap is not equivalent to a recessed slot. Id. at 9. Appellants thus maintain that even if the Figures 8A-D embodiment was modified to include a gap as is used in the Figures 12A-B embodiment, the present invention would not result. Id. Appellants argue Moslehi discloses a clamp ring, which is not equivalent to a shadow ring, and that the purpose of Moslehi's slot is to accommodate cantilever 102. Id. Appellants contend one of ordinary skill in the art would not have had a reason to modify the 5 Appeal2017-005969 Application 12/974,365 Sen Figures 8A-D embodiment, which does not include a cantilever, based on Moslehi. See id. In the Response to Argument section of the Answer, the Examiner clarifies that Moslehi is cited only to "demonstrate[] that including recessed slots in the form annular chamber [sic] is known in the art." Ans. 12. The Examiner disagrees with Appellants' argument that a gap is not a recessed slot, citing to dictionary definitions of "recess" as an indentation in a line and "gap" as a break in a line, in support of a contention that "a recess in a line creates a gap in that line." Id. at 4-- 5. The Examiner explains that when the embodiment ofin [sic] FIGs. 8A-D of Sen[] is modified to include a recess slot (gaps 980d between vertical tab 980c & overhanging portion 980a: FIGs. 12A-B ... & paras [0136]-[0138]) and a depth of the recess slot is optimized to attain any one of an optimum electric field over a wafer edge; an optimum magnetic field at the edge regions of a wafer; and an optimum electric field over a wafer edge and an optimum magnetic field at the edge regions of a wafer, such optimization can result in the depth of the recess slot being less than the thickness of the shadow ring 880. In such case, the recessed slot having the 2nd annular bottom surface defines a thinned portion of the shadow ring 880 between the top of surface the ring [sic] and the 2nd annular bottom surface above the recess slot. Id. at 7 (citing an August 2, 2016, summary of an Applicant Initiated Interview). In their Reply Brief, Appellants argue that in the Sen Figure 12A-B embodiment, gaps 980d pass completely through the body of the shadow ring, and not just the bottom plane, thereby creating openings. Reply Br. 2. Appellants argue the Examiner has not identified evidentiary support for finding that one of ordinary skill in the art would have had a reason to close the top portions of those openings so as to create a recessed slot. Id. at 3. Sen ,r 137 discloses that due to gaps 980d, spar portions are needed to maintain physical contact between vertical tab 980c ( allegedly corresponding to 6 Appeal2017-005969 Application 12/974,365 the claimed "pin member") and overhanging portion 980a ( allegedly corresponding to the claimed "annular lip"), thereby clearly indicating that gaps 980d are completely open, i.e., extend through the entire body of the shadow ring, as argued by Appellants. Further, Sen uses the term "recess" in a manner consistent with its use in the present application, and does not use this term interchangeably with the term "gap." See Sen ,r 112, Fig. 8A (describing recess 828c); compare Sen independent claim 12 (reciting "a gap"), with Sen dependent claim 13 (reciting "a recess"); cf CAE Screenplates, Inc. v. Heinrich Fiedler GmbH & Co. KG, 224 F.3d 1308, 1317 (Fed. Cir. 2000) ("In the absence of any evidence to the contrary, we must presume that the use of these different terms in the claims connotes different meanings."). Therefore, we agree with Appellants that gaps 980d in Sen Figures 12A-B are not recessed slots. We also agree with Appellants that Sen paragraphs 133-138 do not support the Examiner's finding that the gap characteristics are result-effective variables. See Advisory 7-8. In sum, Appellants have argued persuasively that the Examiner reversibly erred in finding the applied prior art discloses or suggests a shadow ring having a recessed slot and a second annular bottom surface located therein in the manner recited in independent claims 1 and 7. Accordingly we do not sustain the rejections of claims 1 and 7; nor do we sustain the rejections of dependent claims 2---6, 9-12, 20, and 21, which are based on the same, unsupported finding. REVERSED 7 Copy with citationCopy as parenthetical citation