Ex Parte Dehe et alDownload PDFPatent Trial and Appeal BoardOct 24, 201814198646 (P.T.A.B. Oct. 24, 2018) Copy Citation UNITED STA TES p A TENT AND TRADEMARK OFFICE APPLICATION NO. FILING DATE 14/198,646 03/06/2014 81722 7590 10/26/2018 Viering, Jentschura & Partner mbB - Inf c/o 444 Brickell A venue Suite 51270 Miami, FL 33131 FIRST NAMED INVENTOR Alfons Dehe UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www .uspto.gov ATTORNEY DOCKET NO. CONFIRMATION NO. P53974US 4107 EXAMINER MCDUFFIE, MICHAEL D ART UNIT PAPER NUMBER 3632 NOTIFICATION DATE DELIVERY MODE 10/26/2018 ELECTRONIC Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the following e-mail address(es): patint@vjp.de vjp-us@vjp.de PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD Ex parte ALFONS DEHE, REINHARD GABL, and ULRICH KRUMBEIN Appeal 2018-003 908 Application 14/198,646 1 Technology Center 3600 Before EDWARD A. BROWN, WILLIAM A. CAPP, and JEFFREY A. STEPHENS, Administrative Patent Judges. BROWN, Administrative Patent Judge. DECISION ON APPEAL STATEMENT OF THE CASE Appellant seeks review under 35 U.S.C. § 134(a) of the Examiner's decision rejecting claims 1---6, 8, 10-16, and 24--29. 2 We have jurisdiction under 35 U.S.C. § 6(b ). We REVERSE. 1 Infineon Technologies AG ("Appellant") is the applicant, under 37 C.F.R. § 1.46, and is identified as the real party in interest. Appeal Br. 3. 2 Claims 7, 9, and 17-23 are cancelled. Id. at 5. Appeal2018-003908 Application 14/198,646 CLAIMED SUBJECT MATTER The claimed subject matter relates to structures that may be used in micro-electro-mechanical system (MEMS) transducers. Spec. ,r 2. According to the Specification, many MEMS transducer systems "require that a very thin membrane be suspended between several support structures in order to operate." Id. Claims 1 and 12 are independent claims. Claim 1 is illustrative, and reads: 1. A structure, comprising: a earner; a suspended structure; a holding structure holding the suspended structure to the carrier; the holding structure comprising a sidewall having a curved section that extends from a top surface of the carrier to a tapered end of the holding structure, the tapered end being attached to a bottom surface of the suspended structure, wherein the holding structure is compositionally graded and further comprises a first material, and a second material different from the first material that is diffused into the first material, wherein a concentration of the second material in the first material is continuously varied as a function of location within the first material relative to the carrier; wherein the top surface of the carrier faces toward the suspended structure, the curved section of the holding structure has a concave shape,and the tapered end of the holding structure physically connects to the suspended structure, and wherein at least a portion of the bottom surface of the suspended structure is free of the holding structure. Appeal Br. 16 (Claims App.). 2 Appeal2018-003908 Application 14/198,646 REJECTIONS Claims 1-6, 8, 10-16, and 25-29 are rejected under 35 U.S.C. § 103 as unpatentable over Adachi (US 8,188,556 B2, issued May 29, 2012). 3 Claim 24 is rejected under 35 U.S.C. § 103 as unpatentable over Adachi and Langereis (US 2011/0169109 Al, published July 14, 2011). ANALYSIS Rejection of Claims 1-6, 8, 10-16, and 25-29 As for claim 1, the Examiner finds that Adachi discloses a structure comprising carrier 22, suspended structure 24, and holding structure 23. Final Act. 2. The Examiner construes the claim term "compositionally graded" as a product-by-process limitation. Id. at 2-3. The Examiner does not make an explicit finding that Adachi' s holding structure is compositionally graded. The Examiner also finds that Briere4 discloses a semiconductor structure comprising two materials that are compositionally graded. Id. at 3 ( citing Briere ,r 41 ). The Examiner concludes that it would have been obvious to use Briere's "compositionally graded" feature "with the semiconductor of Adachi to reduce impurities within the semiconductor," as taught to be desirable by Briere. Id. ( citing Briere ,r 42). Based on this reasoning, we understand that claims 1-6, 8-16, and 25-29 are alternatively rejected as being obvious over Adachi and Briere. 3 The heading of the rejection also lists cancelled claim 9. 4 US 2013/0069208 Al, published Mar. 21, 2013. 3 Appeal2018-003908 Application 14/198,646 Appellant contends that the Examiner's construction of the term "compositionally graded" as a product-by-process limitation is erroneous. Appeal Br. 10-12. Appellant contends that this term does not describe a process, but denotes a physical structure or attribute. Id. at 11-12. The Examiner concedes Appellant's argument is persuasive. Ans. 6. Accordingly, we understand that the Examiner's rejection based on Adachi alone has been overcome by Appellant. Appellant challenges the Examiner's alternative position that it would have been obvious to modify Adachi's device to include compositionally graded semiconductor or holding structure in view of Briere. Appeal Br. 12. Appellant contends that Briere is directed to semiconductor structures including group III-V semiconductor materials used for field-effect transistors (FETs) and high electron mobility transistors (HEMTs). Id. ( citing Briere ,r,r 4--7). Briere describes how impurity sources can adversely affect device performance, and "proposes grading of 'impurity concentration profiles' to address or mitigate these adverse effects." Id. ( citing Briere ,r 3 5). Appellant contends that the semiconductor material that is compositionally graded in Briere for improved performance is part of a device layer and is dissimilar to the holding structure in Adachi. Id. at 13. Specifically, Appellant explains that the semiconductor material is group III- V semiconductor material (Reply Br. 5 ( citing Briere Abstract)), whereas the element in Adachi found to correspond to the claimed holding structure is not made from that material (Appeal Br. 12-13). Accordingly, Appellant contends, there is no support that compositionally grading the "holding structure" in Adachi would provide any benefit to Adachi' s semiconductor sensor. Id. at 13. 4 Appeal2018-003908 Application 14/198,646 In response, the Examiner submits that Adachi discloses a semiconductor structure and teaches the use of silicon and oxide in manufacturing the substrate. Ans. 6. The Examiner submits that Briere likewise discloses a semiconductor structure, as well as teaching the use of compositionally graded materials to reduce impurities. Id. The Examiner finds that Briere discloses that, in addition to carbon, other elements including silicon and oxygen "may lead to impurities." Id. at 6-7 ( citing Briere ,r 36). The Examiner acknowledges that "Adachi does not raise the issue of impurities," but submits that Adachi "disclose[ s] materials that are known to contain impurities (i.e. silicon and oxygen)." Id. The Examiner explains that Briere is utilized in the rejection to teach the reduction of impurities, which "'enables reduced leakage and enhanced standoff voltage capability while concurrently enabling high speed switching by reducing or substantially minimizing sources of undesirable dynamic Rdson."' Id. ( quoting Briere ,r 93). We agree with Appellant that the Examiner does not provide an adequate reason why one of ordinary skill in the art would have modified Adachi in view of Briere to result in the claimed structure. Adachi discloses a semiconductor sensor comprising N-type Si substrate 22 (first semiconductor layer), N-type Si thin film 24 (second semiconductor layer), and Si02 film 23 (insulating layer) located between Si substrate 22 and Si thin film 24. See Adachi, col. 4, 11. 9--17, Fig. 2. Adachi discloses that the thickness of Si02 film 23 decreases from an outer circumferential edge toward a center of diaphragm 25, and includes tapered reinforcement 23a. Id. at col. 4, 11. 28-35, Fig. 2. Adachi teaches that Si02 film 23 is configured 5 Appeal2018-003908 Application 14/198,646 to reinforce diaphragm 25, thereby preventing breakage. Id. at col. 6, 11. 8- 18. Appellant contends that the Examiner does not provide evidence that Si02 film 23 in Adachi's sensor contains impurities, let alone that impurities contained in this layer would adversely affect the sensor. Reply Br. 4. We agree. Appellant also contends, even if Adachi's Si02 film 23 does contain impurities, the Examiner does not show that this layer would benefit from having a compositionally graded impurity profile. Id. Appellant points out that, unlike in Briere, Adachi's Si02 film 23 is not a group III-V compound semiconductor and does not form part of an active semiconductor device. Id. at 5. In contrast, Si 02 film 23 is an insulating layer. Id. at 6 ( citing Adachi, col. 4, 11. 14--17). We are persuaded that the Examiner's stated reason for modifying Adachi's Si02 film 23 (i.e., insulating layer), which corresponds to the benefit described in Briere of reducing the impurity concentration in group III-V semiconductor material in group III-V device structure (see Ans. 7; Briere ,r 93), lacks a rational underpinning. Accordingly, we do not sustain the rejection of claim 1, or of claims 2---6, 8, 10, 11, and 25-28, as unpatentable over Adachi, or over Adachi and Briere. Claim 12 is directed to a structure comprising, among other things, a "holding structure [that] is compositionally graded." Appeal Br. 18 ( Claims App.). The Examiner's findings and reasoning for rejecting claim 12 are the same as for claim 1. See Final Act. 2-3. Accordingly, we do not sustain the rejection of claim 12, or of claims 13-16 and 29 depending therefrom, as unpatentable over Adachi, or over Adachi and Briere. 6 Appeal2018-003908 Application 14/198,646 Rejection of Claim 24 As claim 24 depends from claim 1, for consistency, we treat this rejection as being based on Adachi and Langereis, or, alternatively, over Adachi, Briere, and Langereis. For both cases, the Examiner's reliance on Langereis in rejecting claim 24 fails to cure the deficiencies in the rejection of claim 1 discussed above. See Final Act. 4--5. Accordingly, we do not sustain the rejection of claim 24 as unpatentable over Adachi and Langereis, or over Adachi, Briere, and Langereis. DECISION We reverse the rejections of claims 1---6, 8, 10-16, and 24--29. REVERSED 7 Copy with citationCopy as parenthetical citation