Ex Parte Chang et alDownload PDFBoard of Patent Appeals and InterferencesMar 20, 201210714305 (B.P.A.I. Mar. 20, 2012) Copy Citation UNITED STATES PATENT AND TRADEMARKOFFICE UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www.uspto.gov APPLICATION NO. FILING DATE FIRST NAMED INVENTOR ATTORNEY DOCKET NO. CONFIRMATION NO. 10/714,305 11/14/2003 Jei-Wei Chang HTIRC03-005 2109 7590 03/20/2012 GEORGE O. SAILE 28 DAVIS AVENUE POUGHKEEPSIE, NY 12603 EXAMINER CHACKO DAVIS, DABORAH ART UNIT PAPER NUMBER 1722 MAIL DATE DELIVERY MODE 03/20/2012 PAPER Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE ____________ BEFORE THE BOARD OF PATENT APPEALS AND INTERFERENCES ____________ Ex parte JEI-WEI CHANG, CHAO-PENG CHEN, CHUNPING LUO, and SHOU-CHEN KAO ____________ Appeal 2010-003023 Application 10/714,305 Technology Center 1700 ____________ Before CHARLES F. WARREN, JEFFREY T. SMITH, and BEVERLY A. FRANKLIN, Administrative Patent Judges. FRANKLIN, Administrative Patent Judge. DECISION ON APPEAL Appellants appeal under 35 U.S.C. § 134 from the Examiner's rejection of claims 1-3 and 5-9. We have jurisdiction under 35 U.S.C. § 6. STATEMENT OF THE CASE Claim 1 is representative of the subject matter on appeal and is set forth below: Appeal 2010-003023 Application 10/714,305 2 1. A liftoff method for photolithography, comprising: depositing a single layer of photoresist on a substrate; exposing and developing said photoresist layer thereby forming a photoresist pattern having sidewalls and an upper surface; irradiating said upper surface with an ion beam having a direction parallel to said sidewalls, said ion beam comprising ions whose energy is too low to sputter said layer of photoresist; maintaining said ion beam irradiation for a time period whereby a hardened layer is formed that extends a distance downwards from said upper surface, all remaining photoresist being unhardened; then exposing said photoresist pattern to ozone whereby said sidewalls are eroded and said hardened layer is unchanged so that the hardened layer overhangs the unhardened layer; depositing a layer of a material onto all horizontal surfaces to a thickness that is less than that of said unhardened photoresist layer; and selectively removing said unhardened photoresist layer whereby all of said material that is deposited onto said hardened photoresist layer is lifted off. The prior art relied upon by the Examiner in rejecting the claims on appeal is: Yamada et al. (Yamada) 4,904,619 Feb. 27, 1990 Leuschner et al. (Leuschner) 5,512,334 Apr. 30, 1996 Kim et al. (Kim) US 2002/0001957 A1 Jan. 3, 2002 Furihata et al. (Furihata) 6,389,944 B1 May 7, 2002 Bloomstein et al. (Bloomstein) 6,833,234 B1 Dec. 21, 2004 Appeal 2010-003023 Application 10/714,305 3 THE REJECTIONS 1. Claims 1-3 and 5-9 are rejected under 35 U.S.C. §103(a) as being unpatentable Yamada in view of Bloomstein. 2. Claim 3 is rejected under 35 U.S.C. §103(a) as being unpatentable over Yamada in view of Bloomstein and further in view of Furihata. 3. Claim 7 is rejected under 35 U.S.C. §103(a) as being unpatentable over Yamada in view of Bloomstein and further in view of Kim. 4. Claim 9 is rejected under 35 U.S.C. §103(a) as being unpatentable over Yamada in view of Bloomstein and further in view of Leuschner. ISSUE Did the Examiner err in determining that Yamada teaches the aspect of claim 1 of “irradiating said upper surface with an ion beam having a direction parallel to said sidewalls, said ion beam comprising ions whose energy is too low to sputter said layer of photoresist”? We answer this question in the affirmative and REVERSE. ANALYSIS Appellants argue that Yamada’s sputter etching is not the same as the ion beam irradiation recited in claim 1. Br. 7. We agree because the Examiner has not established on this record that Yamada’s sputter etching is equivalent to the ion beam process step according to Appellants’ claim 1. See generally Answer. In a §103(a) obviousness rejection, the Patent Office Appeal 2010-003023 Application 10/714,305 4 has the initial burden of establishing a prima facie case. To establish prima facie obviousness of a claimed invention, all the claim limitations must be taught or suggested by the prior art. "When determining whether a claim is obvious, an examiner must make a searching comparison of the claimed invention, including all its limitations, with the teaching of the prior art." In re Ochiai, 71 F.3d 1565, 1572 (Fed. Cir. 1995). Also, arguments and conclusions unsupported by factual evidence carry no evidentiary weight. In re De Blauwe, 736 F.2d 699, 705 (Fed. Cir. 1984); In re Lindner, 457 F.2d 506, 508 (CCPA 1972). In view of the above, we therefore reverse Rejection 1. Because the other applied references in the other rejections do not cure this deficiency of Yamada, we reverse Rejections 2, 3, and 4 also. CONCLUSIONS OF LAW AND DECISION Each rejection is reversed. REVERSED cam Copy with citationCopy as parenthetical citation