Ex Parte Biskeborn et alDownload PDFBoard of Patent Appeals and InterferencesJan 27, 201210769271 (B.P.A.I. Jan. 27, 2012) Copy Citation UNITED STATES PATENT AND TRADEMARK OFFICE UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www.uspto.gov APPLICATION NO. FILING DATE FIRST NAMED INVENTOR ATTORNEY DOCKET NO. CONFIRMATION NO. 10/769,271 01/30/2004 Robert Glenn Biskeborn IBM1P039/SJ0920030031US1 7862 50548 7590 01/30/2012 ZILKA-KOTAB, PC- IBM P.O. BOX 721120 SAN JOSE, CA 95172-1120 EXAMINER RENNER, CRAIG A ART UNIT PAPER NUMBER 2627 MAIL DATE DELIVERY MODE 01/30/2012 PAPER Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE ________________ BEFORE THE BOARD OF PATENT APPEALS AND INTERFERENCES ________________ Ex parte ROBERT GLENN BISKEBORN and JAMES HOWARD EATON ________________ Appeal 2009-009960 Application 10/769,271 Technology Center 2600 ________________ Before JOSEPH F. RUGGIERO, THOMAS S. HAHN, and ELENI MANTIS MERCADER, Administrative Patent Judges. HAHN, Administrative Patent Judge. DECISION ON APPEAL Appeal 2009-009960 Application 10/769,271 2 Appellants invoke our review under 35 U.S.C. § 134(a) from the final rejection of claims 1, 2, 4, 6, 9-14, 18, and 22.1 We have jurisdiction under 35 U.S.C. § 6(b). We affirm-in-part. STATEMENT OF THE CASE Appealed claims 1 and 22 are exemplary and read: 1. A tape head, comprising: first and second beams each having a tape bearing surface, a face, a recess in the tape bearing surface thereof, the faces of the beams facing towards each other, wherein at least central regions of the faces are spaced apart; a first chip being positioned in the recess of the first beam; and a second chip being positioned in the recess of the second beam; wherein each chip has circuitry selected from a group consisting of read elements, write elements, and combinations thereof, at least one of the chips having read elements; wherein a tape bearing surface of each chip is generally aligned with the tape bearing surface of the associated beam; wherein an end of each chip is generally aligned with the face of the associated beam. 22. A tape head, comprising: first and second beams each having a tape bearing surface, a face, a recess in the tape bearing surface thereof, the faces of the beams facing away from each other; a first chip being positioned in the recess of the first beam; and a second chip being positioned in the recess of the second beam; wherein each chip has circuitry selected from a group consisting of read elements, write elements, and combinations thereof; wherein a tape bearing surface of each chip is generally aligned with the tape bearing surface of the associated beam; 1 Claims 3, 5, 7, 8, 15-17, 19-21, 23, and 24 have been withdrawn. Appeal 2009-009960 Application 10/769,271 3 wherein an end of each chip is generally aligned with the face of the associated beam. Rejections A. The Examiner under 35 U.S.C. § 102 rejected: 1. Claims 1, 2, 4, 6, 9, 12-14, 18, and 22 as anticipated by Sand (US 3,610,839; Oct. 5, 1971) (Final Action 4-7); 2. Claims 1, 4, 6, 13, and 22 as anticipated by Momata (US 4,695,909; Sep. 22, 1987) (Final Action 7-10); and 3. Claim 22 as anticipated by Rumpler (US 6,577,470 B1; June 10, 2003) (Final Action 10-11). B. The Examiner rejected claims 1, 2, 4, and 9-11, under 35 U.S.C. § 103(a), as obvious over Rumpler and Fields (US 4,685,005; Aug. 4, 1987) (Final Action 11-13). Appellants’ Contentions 1. Appellants pivotally contend that Sand is a deficient anticipation reference because “chip” as recited in independent claims 1, 13, and 22 is not explicitly or inherently taught in the reference (App. Br. 12, 14; Reply Br. 3, 8). 2. Appellants pivotally contend that Momata is a deficient anticipation reference because “chip” as recited in independent claims 1, 13, and 22 is not explicitly or inherently taught in the reference (App. Br. 15; Reply Br. 10). 3. Appellants also contend that Rumpler is a deficient anticipation reference because claim 22 recites structures not explicitly or inherently taught in the reference, namely (i) first and second beams having faces that face away from each other, and (ii) chips having Appeal 2009-009960 Application 10/769,271 4 tape bearing surfaces generally aligned with beam tape bearing surfaces (App. Br. 16; Reply Br. 11-12). 4. Appellants contend the Examiner erred in rejecting claim 1 under § 103(a) because, alone or in combination, Rumpler and Fields fail to teach or fairly suggest the recited chip tape bearing surface being generally aligned with an associated beam tape bearing surface (App. Br. 17; Reply Br. 15-16). ANALYSIS Anticipation Rejection over Sand Appellants group rejected claims 1, 2, 4, 9, 12, and 22, and argue the Examiner erred in rejecting independent claims 1 and 22 (App. Br. 11-13) because Sand fails to teach the recited “chip” (see Appellants’ contention 1 supra). Specifically, Appellants contend that “one skilled in the art reading the claims would interpret the term ‘chip’ as referring to an integrated circuit or a small wafer of semiconductor material that forms the base for an integrated circuit, as opposed to ‘a small piece’ as proposed by the Examiner” (App. Br. 12). Further, Appellants contend that “[c]hips by any definition are simply not found in Sand” (id.). The Examiner does not dispute that Sand is silent concerning disclosing any structure labeled a “chip.” However, the Examiner responds that “the term chip has an established meaning in the art that does not necessarily mean an integrated circuit or a small wafer of semiconductor material that forms the base for an integrated circuit” (Ans. 13). The Examiner references Yasuda (US 4,713,709; Dec. 15, 1987) as extrinsic evidence and states, without identification to any disclosure in the reference, Appeal 2009-009960 Application 10/769,271 5 that Yasuda “supports the . . . interpretation of the term chip to mean a small piece in the same field of endeavor and not an integrated circuit or a small wafer of semiconductor material that forms the base for an integrated circuit” (id.). We find the Examiner’s reasoning and conclusion for construing the recited “chip” to be problematic. Claim examination requires application of “the broadest reasonable meaning of the [claim] words in their ordinary usage as they would be understood by one of ordinary skill in the art, taking into account whatever enlightenment by way of definitions or otherwise that may be afforded by the written description contained in applicant’s specification.” In re Morris, 127 F.3d 1048, 1054 (Fed. Cir. 1997); see also Renishaw PLC v. Marposs Societa’ per Azioni, 158 F.3d 1243, 1250 (Fed. Cir. 1998) (“[W]here there are several common meanings for a claim term, the patent disclosure serves to point away from the improper meanings and toward the proper meaning.”). The chips covered by both of claims 1 and 22 are recited as having “circuitry.” The Specification, we find, discloses that chip circuitry is “formed by traditional thin film processing” on a thin film wafer (Spec. 10:1-4; see App. Br. 15). Based on this record and the direction from our reviewing court, we disagree with the Examiner’s interpretation that the recited chip is “not an integrated circuit or a small wafer of semiconductor material that forms the base for an integrated circuit” (Ans. 13). Accordingly, we agree with Appellants that a skilled artisan would interpret the recited chip as an integrated circuit or a small wafer of semiconductor material that forms the base for an integrated circuit, and, therefore, Sand is deficient in anticipating claims 1 and 22. Appeal 2009-009960 Application 10/769,271 6 Appellants also group rejected claims 6, 13, 14, and 18, and argue, inter alia, that the Examiner erred in rejecting independent claim 13 (App. Br. 13-14) because Sand fails to teach the recited “chip” (see Appellants’ contention 1 supra). Appellants’ arguments are addressed supra and for the reasons indicated supra we agree with Appellants’ contention that Sand is deficient in anticipating claim 13. For the foregoing reasons, we do not sustain the rejection of claims 1, 13, and 22 as anticipated by Sand, and we also do not sustain the rejection of claims 2, 4, 6, 9, 12, 14, and 18 that are not separately argued. Anticipation Rejection over Momata Appellants group rejected claims 1, 4, 6, 13, and 22, and argue the Examiner erred in rejecting independent claims 1, 13, and 22 (App. Br. 15) because Momata fails to teach the recited “chip” (see Appellants’ contention 2 supra). As with Sand, Appellants contend that “[c]hips are not found in Momata” (App. Br. 15) and the Examiner does not dispute that Momata is silent concerning disclosing any structure labeled a “chip” (see Ans. 14-15). Appellants substantively assert the same arguments for why Momata is a deficient anticipatory reference as are addressed supra for Sand and for the same reasons indicated supra we agree with Appellants’ contention that Momata also is deficient in anticipating claims 1, 13, and 22. For the foregoing reasons, we do not sustain the rejection of claims 1, 13, and 22 as anticipated by Momata, and we also do not sustain the rejection of claims 4 and 6. Appeal 2009-009960 Application 10/769,271 7 Anticipation Rejection over Rumpler Appellants argue (App. Br. 16; Reply Br. 11-12) that the Examiner erred in rejecting claim 22 because Rumpler fails to teach a recited first and second beams having faces that face away from each other, and also recited “chip[s]” having tape bearing surfaces generally aligned with beam tape bearing surfaces (see Appellants’ contention 3 supra). Appellants, inter alia, assert as conclusory attorney argument that: The Examiner chose a broad interpretation of “aligned” to mean brought into correct relative position thereto. However, this broad interpretation does not make sense when read into the claim: “wherein an end of each chip is generally aligned with the face of the associated beam.” If the end of each chip were generally brought into correct relative position with the face of the associated beam, the invention would still not properly function because the end of the chip must be aligned with the face of the beam, sharing a common plane. Therefore, the Examiner’s definition of “aligned” would render the invention unsatisfactory for its intended purpose. (App. Br. 16.) The Examiner responds and identifies finding: Rumpler does teach that the faces of the beams (110 and 160) face away from each other, wherein an end of each chip (102 or 152) is generally aligned with the face of the associated beam (as shown in Figures 2A and 3A, for instance). Note that the term “aligned” does not necessarily import the limitation “sharing the same plane,” but may be broadly construed to merely mean brought into correct relative position thereto. (Ans. 16.) Based on our review of the record, we agree with and adopt the Examiner’s findings as identified above. In part, we note that despite Appellants’ argument, claim 22 neither recites “sharing a common plane” nor is such a limitation a part of the claim. See SuperGuide Corp. v. DirecTV Enters., Inc., 358 F.3d 870, 875 (Fed. Cir. Appeal 2009-009960 Application 10/769,271 8 2004) (“Though understanding the claim language may be aided by the explanations contained in the written description, it is important not to import into a claim limitations that are not a part of the claim.”). We also note that claim 22 broadly recites first and second beams having faces, but does not recite identifications as to what beam faces are intended to be identified or excluded. Accordingly, we agree with the Examiner that Rumpler teaches the disputed claim 22 limitations. We sustain the Examiner’s rejection of claim 22 as being anticipated by Rumpler. Obviousness Rejection over Rumpler and Fields Appellants group rejected claims 1, 2, 4, and 9-11, and argue the Examiner erred in rejecting independent claim 1 (App. Br. 17-18) because Rumpler fails to teach or fairly suggest the claim 1 recited “wherein a tape bearing surface of each chip is generally aligned with the tape bearing surface of the associated beam” (see Appellants’ contention 4 supra). Appellants also assert that Fields is relied on by the Examiner to teach that read and write elements were known in the art, which does not overcome the contended deficiency of Rumpler (id.). The Examiner substantively relies on the response addressed supra for why Rumpler anticipates claim 22 (Ans. 16), and we continue to agree with the Examiner’s findings from Rumpler. Accordingly, we do not find Rumpler deficient, and we, therefore, sustain the rejection of argued claim 1.2 Further, we sustain the rejection of claims 2, 4, and 9-11 that are not separately argued. 2 It is noted that obviousness and anticipation rejections of independent claims 1 and 22 over Rumpler have been affirmed. Because of this record, Appeal 2009-009960 Application 10/769,271 9 DECISION The Examiner’s decision rejecting claims 1, 2, 4, 9-11, and 22 is affirmed, and the Examiner’s decision rejecting claims 6, 12-14, and 18 is reversed. No time period for taking any subsequent action in connection with this appeal may be extended under 37 C.F.R. § 1.136(a)(1)(v). AFFIRMED-IN-PART babc the Examiner’s attention is directed to the fact that independent claim 13 which recites similar limitations has not been rejected over Rumpler. Copy with citationCopy as parenthetical citation