Ex Parte Benjamin et alDownload PDFPatent Trial and Appeal BoardMar 25, 201311001219 (P.T.A.B. Mar. 25, 2013) Copy Citation UNITED STATES PATENT AND TRADEMARK OFFICE ____________________ BEFORE THE PATENT TRIAL AND APPEAL BOARD ____________________ Ex parte NEIL BENJAMIN and ROBERT STEGER ____________________ Appeal 2012-010297 Application 11/001,219 Technology Center 3700 ____________________ Before: JENNIFER D. BAHR, JOHN C. KERINS, and KEN B. BARRETT, Administrative Patent Judges. BAHR, Administrative Patent Judge. DECISION ON APPEAL Appeal 2012-010297 Application 11/001,219 2 STATEMENT OF THE CASE Neil Benjamin and Robert Steger (Appellants) appeal under 35 U.S.C. § 134 from the Examiner’s decision rejecting claims 50-52, 59-62, 76, and 77. The Examiner withdrew claims 53-58 from consideration. We have jurisdiction under 35 U.S.C. § 6(b). This is the second appeal in the present application. See Ex parte Benjamin, No. 2009-008656 (BPAI Jan. 27, 2011), http://efoia.uspto.gov/Foia/ReterivePdf?system=BPAI&flNm= fd2009008656-01-25-2011-1. We REVERSE. The Claimed Subject Matter Claim 50, reproduced below, is illustrative of the claimed subject matter. 50. A workpiece chuck assembly for a plasma processor, the chuck comprising: a temperature-controlled base configurable to have a temperature below a desired processing temperature of a workpiece; a layer of thermal insulation disposed over the base; and a wafer support element disposed over the base, the wafer support element including at least an inner spiral portion and an outer spiral portion, wherein the inner spiral portion is configured to affect the temperature of an inner disk temperature zone of a workpiece, and the outer spiral portion is configured to affect the temperature of an outer annular temperature zone of the workpiece and wherein the inner spiral portion and the outer spiral portion function as electrodes allowing the wafer support element to function as either a mono-polar electrostatic chuck or a bi-polar electrostatic chuck. Evidence The Examiner relied on the following evidence in rejecting the claims on appeal: Appeal 2012-010297 Application 11/001,219 3 Young Stevko Carman Schaper Kawanabe Babikian US 2,152,126 US 3,634,740 US 5,294,778 US 5,802,856 US 6,133,557 US 6,472,643 B1 Mar. 28, 1939 Jan. 11, 1972 Mar. 15, 1994 Sep. 8, 1998 Oct. 17, 2000 Oct. 29, 2002 Rejection Appellants request our review of the Examiner’s rejection of claims 50-52, 59-62, 76 and 77 under 35 U.S.C. § 103(a) as unpatentable over Babikian, Carman or Schaper, Kawanabe, Young, and Stevko. OPINION Appellants’ independent claim 50 is directed to a workpiece chuck having inner and outer spiral elements configured to affect the temperature of inner and outer zones of a workpiece, respectively, and further configured to function as electrodes allowing the wafer support element to function as a mono-polar or bi-polar electrostatic chuck. Claim 77 is directed to a workpiece chuck assembly having inner and outer spiral elements configured to affect the temperature of inner and outer zones of a workpiece and further configured to electrostatically clamp the workpiece to the wafer support element upon being energized. Claim 59 is directed to a method of controlling spatial temperature across a workpiece comprising steps of holding the workpiece against a top surface of a wafer support element having inner and outer spiral elements that function as electrodes allowing the wafer support element to function as a mono-polar or bi-polar electrostatic chuck and controlling the inner and outer spiral elements to affect the temperature of inner and outer zones of the workpiece. The Examiner’s rejection rests in part on the determination that it would have been obvious, in view of the teachings of Kawanabe and Appeal 2012-010297 Application 11/001,219 4 Carman or Schaper, to adapt Babikian’s apparatus with inner and outer spiral portions to affect the temperature of associated portions of the wafer support element to independently heat corresponding portions of the workpiece, wherein the inner and outer spiral portions “can be used as electrodes for the electrostatic chucks as taught by Kawanabe.” Ans. 6. The Examiner finds that Kawanabe shows the same conductive element arrangements used for heating, electrostatic adhesion, and plasma generation, wherein each of the conductive elements can be made of substantially the same material and composition. Ans. 7-8. The Examiner additionally finds that Stevko teaches electrically conductive elements used as electrodes connected by a voltage potential applied between the electrodes to create an electrostatic field for the electrostatic holding or chucking force and Young teaches electrically conductive elements used as heat generating resistance elements with electrical power connections made at the terminals of each conductive element to cause electrical current flow therein. Ans. 6. Thus, the Examiner finds that Stevko and Young together evidence that the same electrical conductor configuration can be used as an electrostatic chuck or as an electrical heater, depending upon how the voltage potential is applied, as illustrated by Kawanabe. Id. In other words, according to the Examiner, “one of ordinary skill in the art would predictably determine that the conductive elements as shown in each arrangements [sic] allow for performing different heating, electrostatic function, or plasma generating function based on how a voltage power is connected thereto.” Ans. 8. Consequently, the Examiner concludes that “one of ordinary skill would have been motivated to adapt Appeal 2012-010297 Application 11/001,219 5 Babikian, as modified by Carman or Schaper, . . . to not only use a conductive heating element as a heating resistor/element but also as an electrostatic electrode, based on how voltage power is connected thereto, to predictably perform the known applications in the art.” Id. Appellants argue that the applied prior art does not teach or suggest using the same electrode for heating and electrostatic clamping. App. Br. 11. While Kawanabe discloses compositions that can be used both as a heating resistor and as an electrostatic adhesion electrode (col. 5, ll. 55-57; col. 6, ll. 1-5), the Examiner has not articulated an apparent reason why a person having ordinary skill in the art would have been prompted to use the spiral heating elements of the modified Babikian apparatus for both functions. As noted by Appellants (App. Br. 11, 12), Schaper and Kawanabe both teach wafer processing equipment incorporating heating elements and electrostatic clamping elements. See Schaper, col. 11, ll. 30- 34; col. 12, ll. 18-21; Kawanabe, col. 9, l. 13; col. 10, ll. 1-2. However, both Schaper and Kawanabe teach heating elements which are distinct from the electrostatic clamping elements. Kawanabe, in fact, explicitly points out that a single electrode may be used as the electrostatic adhesion electrode and the plasma generation electrode (col. 9, ll. 61-64), but separately discusses a heating resistor as a distinct element (col. 10, ll. 1-2). Moreover, Appellants argue that the Examiner “does not explain how Babikian’s thermal diffuser 230 would enable an electrostatic chucking electrode in thermal source 240 to operate to electrostatically clamp wafer 200” (App.Br. 11), and the Examiner does not respond to that argument. Stevko describes a dielectric top coating for the electrostatic hold down Appeal 2012-010297 Application 11/001,219 6 device (col. 2, ll. 62-64; col. 4, ll. 13-17). Kawanabe discloses a ceramic base body for its electrostatic chuck (col. 1, ll. 38-43; col. 4, ll. 3-5). Young and Babikian, on the other hand, disclose a high conductivity material such as copper on the upper surfaces of their heating devices. Young, p. 1, col. 2, ll. 51-54 (discussing plate or disc 21); Babikian, col. 2, ll. 58, 61-63 (discussing thermal diffuser 230). These structural distinctions between the top surface of the body in which the electrostatic chucking electrodes are disposed and the top surface of the body in which the heating elements are disposed raise a legitimate question as to whether an electrode in Babikian’s thermal source 240 would be capable of functioning as an electrostatic chucking electrode within Babikian’s assembly allowing the assembly to function as an electrostatic chuck. For the above reasons, the Examiner fails to establish a prima facie case of obviousness of the subject matter of claims 50 and 77, particularly a workpiece chuck having inner and outer spiral electrodes that are configured to affect workpiece temperature and also configured to function as electrodes for functioning as an electrostatic chuck. The Examiner also fails to establish a prima face case of obviousness of the subject matter of claim 59, particularly a method wherein the spiral elements affect the temperature of a workpiece and further function as electrodes allowing the wafer support to function as an electrostatic chuck. Accordingly, we do not sustain the Examiner’s rejection of claims 50- 52, 59-62, 76 and 77 under 35 U.S.C. § 103(a) as unpatentable over Babikian, Carman or Schaper, Kawanabe, Young, and Stevko. Appeal 2012-010297 Application 11/001,219 7 DECISION The Examiner’s decision rejecting claims 50-52, 59-62, 76, and 77 is reversed. REVERSED peb Copy with citationCopy as parenthetical citation