Current through October 31, 2024
Section 675 IAC 22-2.5-20 - Chapter 27; semiconductor fabrication facilitiesAuthority: IC 22-13-2-2
Affected: IC 22-12-7; IC 22-13; IC 22-14; IC 36-8-17
Sec. 20.
Chapter 27 is amended as follows:
(a) Delete Section 2701.5 without substitution.(b) Amend Section 2703.3.3 to delete "34" and insert "57".(c) Amend Section 2703.14.1 to delete the second sentence of item number one without substitution. Filed 8/1/2014, 11:01 a.m.: 20140827-IR-675130341FRA, eff 12/1/2014Readopted filed 8/6/2020, 2:04 p.m.: 20200902-IR-675200309RFA