Note 1 to paragraph (a)(3)(ii): This paragraph (a)(3)(ii) includes items subject to the EAR pursuant to the foreign direct product rule in § 734.9(h)(1)(i)(B) (1) and (h)(2)(ii) of the EAR.
Note 1 to paragraph (a)(4): Front-end integrated circuit "production" equipment includes equipment used in the production stages from a blank wafer or substrate to a completed wafer or substrate (i.e., the integrated circuits are processed but they are still on the wafer or substrate). If there is a question at the time of export, reexport, or transfer (in-country) about whether equipment is used in front-end integrated circuit "production," you may submit an advisory opinion request to BIS pursuant to § 748.3(c) of the EAR for clarification.
Note 2 to paragraph (a)(4): For transactions involving "development" or "production" in Macau or a destination specified in Country Group D:5 by an entity that is headquartered in Macau or a destination specified in Country Group D:5, but the "development" or "production" is undertaken at the direction of an entity headquartered in the United States or a destination specified in Country Group A:5 or A:6, refer to General Order No. 4 in Supp. No. 1 to Part 736 (Temporary General License-Less restricted SME "parts," "components," or "equipment").
15 C.F.R. §744.23