Ex Parte ChengDownload PDFBoard of Patent Appeals and InterferencesFeb 23, 200910908722 (B.P.A.I. Feb. 23, 2009) Copy Citation UNITED STATES PATENT AND TRADEMARK OFFICE ____________ BEFORE THE BOARD OF PATENT APPEALS AND INTERFERENCES ____________ Ex parte KANGGUO CHENG ____________ Appeal 2008-6197 Application 10/908,722 Technology Center 2800 ____________ Decided:1 February 23, 2009 ____________ Before EDWARD C. KIMLIN, CHUNG K. PAK, and LINDA M. GAUDETTE, Administrative Patent Judges. GAUDETTE, Administrative Patent Judge. DECISION ON APPEAL 1 The two-month time period for filing an appeal or commencing a civil action, as recited in 37 C.F.R. § 1.304, begins to run from the Decided Date shown on this page of the decision. The time period does not run from the Mail Date (paper delivery) or Notification Date (electronic delivery). Appeal 2008-6197 Application 10/908,722 Appellant appeals under 35 U.S.C. § 134(a) from the Examiner’s decision finally rejecting claims 1-4, 6-12, 22, and 23 (Final Office Action, mailed Sept. 20, 2006), the only claims pending in the application. We have jurisdiction under 35 U.S.C. § 6(b). We AFFIRM. STATEMENT OF THE CASE Claim 1, the sole independent claim, is illustrative of the subject matter on appeal, and is reproduced from Appendix B to the Amended Appeal Brief2: 1. A method of forming a semiconductor wafer having a device layer of semiconductor separated from a substrate layer by a separation layer of insulator comprising the steps of: providing first and second semiconductor wafers, each having a bonding surface; forming a layer of bonding insulator on at least one of said bonding surfaces; incorporating deuterium [in] said layer of bonding insulator; bonding said wafers at said layer of bonding insulator, thereby forming a separation layer from said layer of bonding insulator; and forming a device layer in one of said first and second semiconductor wafers. Appellant requests review of the following grounds of rejection (Amended Appeal Brief (“Br.”), filed July 9, 2007, 3): 2 (See Ans. 2, § (4) (noting entry of Appellant’s amendment after final rejection, filed Feb. 20, 2007).) 2 Appeal 2008-6197 Application 10/908,722 1. claims 1, 2, 4, 7, 9, and 11 under 35 U.S.C. § 103(a) as unpatentable over Henley in view of Moriceau; 2. claims 3, 10, and 12 under 35 U.S.C. § 103(a) as unpatentable over Henley in view of Moriceau and further in view of Usenko; 3. claims 6 and 22 under 35 U.S.C. § 103(a) as unpatentable over Henley in view of Moriceau and further in view of Lyding; 4. claim 8 under 35 U.S.C. § 103(a) as unpatentable over Henley in view of Moriceau and Lyding and further in view of Usenko; and 5. claim 23 under 35 U.S.C. § 103(a) as unpatentable over Henley in view of Moriceau and further in view of Jiang. ISSUE Has Appellant shown reversible error in the Examiner’s determination that it would have been obvious to have replaced the particles implanted in Henley’s gettering layer with deuterium, based on Moriceau’s disclosure? We answer this question in the negative. FINDINGS OF FACT (“FF”) 1. Henley discloses a process in which a silicon wafer substrate is joined to a workpiece (col. 6, ll. 49-50), such as a silicon wafer (col. 6, ll. 56-57). Henley discloses an embodiment in which at least one of the wafers includes a gettering layer comprising particles implanted into an insulating layer on a surface which is to be joined to the other wafer (col. 6, ll. 28-32 and 58-61). According to Henley, the particles can include a variety of materials which either form gas bubbles or implanted precipitates (col. 6, ll. 33-35), such as “helium, neon, argon, krypton, and xenon” (col. 5, ll. 26-28). The microbubbles or implanted precipitates act as gettering (i.e., trapping 3 Appeal 2008-6197 Application 10/908,722 (see col. 5, ll. 29-30; 40-41)) sites for impurities (col. 2, ll. 42-45). Henley also discloses that “hydrogen ions” and ions formed from noble gases, may be implanted into a silicon region of a bonded structure, to form a gettering layer (col. 10, ll. 20-37). 2. Moriceau discloses a method for producing a multilayer structure by molecular adhesion techniques (col. 1, ll. 6-8), i.e., wafer bonding (col. 1, l. 22). “[T]he invention more specifically relates to a method for producing a multilayer structure comprising at least a first and second layers called main layers, connected with each other by a stack of at least two stress adaptation layers and having a determined structure stress” (col. 4, ll. 25-30). 3. Moriceau discloses that a known technique for making of a fracture area in a layer is by implantation of a gas species able to generate an embrittled layer formed of microcavities or gas microbubbles (col. 6, ll. 30- 35). Moriceau defines a “microcavity or gas microbubble” as “any cavity generated by implantation of hydrogen gas and/or rare gas ions in the material” (col. 6, ll. 36-38). Moriceau identifies exemplary gas species as “hydrogen or rare gases in their atomic form (for example H), or in their molecular form (for example H2) or in their ion form (for example H+, H2+) or in their isotope form (for example deuterium) or isotope and ion form” (col. 6, ll. 48-52). 4. The Examiner finds that Henley discloses the invention as claimed with the exception of an express disclosure of incorporating deuterium in the layer of bonding insulator. (Ans. 4.) The Examiner notes that Henley does, however, specifically disclose using hydrogen ions and noble gases to form implanted precipitates or gas bubbles to act as gettering 4 Appeal 2008-6197 Application 10/908,722 sites. (Ans. 4.) The Examiner further notes that Moriceau teaches that gas bubbles may be formed in semiconductor layers by implanting hydrogen gas and/or rare gas ions, as well as deuterium, the isotope form of hydrogen gas. (Ans. 4.) The Examiner thus concludes that one of ordinary skill in the art at the time of the invention would have had a reasonable expectation of success in implanting deuterium in Henley’s insulating layer to form a gettering layer based on Moriceau’s disclosure that deuterium forms microbubbles in the same manner as the gases used by Henley to form gas bubbles or implanted precipitates. (Ans. 5.) 5. Appellant concedes that Henley discloses the implantation of hydrogen, but argues that Henley does not explicitly disclose implanting hydrogen in the context of forming a gettering layer prior to forming an SOI bonded structure. (Br. 4.) More specifically, Appellant argues that Henley only discloses the use of “hydrogen as a getter which is implanted into a silicon region after formation of the SOI bonded structure” (Br. 4). Appellant also concedes that Moriceau discloses the implantation of hydrogen, but argues that the hydrogen implant is not intended to form part of the resulting semiconductor-on-insulator (“SOI”) structure. (Br. 5.) Appellant further argues that neither Usenko, Lyding, nor Jiang discloses or suggests formation of SOI wafers or placement of deuterium in the insulator layer used to bond the initial wafers used for forming SOI wafers. (Br. 5-8 (discussing Grounds of Rejection 2-5).) Appellant thus contends that the combined teachings of Henley and Moriceau, alone or as further modified in view of Usenko, Lyding and/or Jiang, would not result in a process in which “deuterium is incorporated in at least one of said layers of bonding insulator as required by the present claims.” (Br. 5, 6, and 7-8.) 5 Appeal 2008-6197 Application 10/908,722 PRINCIPLES OF LAW “The combination of familiar elements according to known methods is likely to be obvious when it does no more than yield predictable results.” KSR Int’l Co. v. Teleflex Inc., 127 S. Ct. 1727, 1739 (2007). The question to be asked is “whether the improvement is more than the predictable use of prior art elements according to their established functions.” Id. at 1740. In considering the question of the obviousness of a claimed invention in view of the prior art relied upon, we are guided by the basic principle that the question under 35 U.S.C. § 103 is not merely what the references expressly teach but what they would have suggested to one of ordinary skill in the art at the time of the invention. See Merck & Co., Inc. v. Biocraft Labs., Inc., 874 F.2d 804, 807-08 (Fed. Cir. 1989); In re Keller, 642 F.2d 413, 425 (CCPA 1981) (“The test for obviousness is not . . . that the claimed invention must be expressly suggested in any one or all of the references.”). “For obviousness under § 103, all that is required is a reasonable expectation of success.” In re O’Farrell, 853 F.2d 894, 903-04 (Fed. Cir. 1988) (citations omitted). ANALYSIS We are not persuaded of reversible error on the part of the Examiner because Appellant has not addressed the facts and reasons relied on by the Examiner in rejecting the claims. Appellant’s traversal of the Examiner’s rejections is based on a contention that modification of Henley’s method in view of Moriceau would not result in the claimed invention, because Moriceau’s implantation step serves a different purposed than Henley’s implantation step. In particular, Appellant points out that Moriceau’s implanted particles are not intended to 6 Appeal 2008-6197 Application 10/908,722 form part of the resulting SOI structure, whereas Henley’s particles do form part of the final structure. However, the Examiner’s rejection is not based on a determination that it would have been obvious to have replaced Henley’s implantation step with Moriceau’s, e.g., to form a fracture layer in Henley’s structure. Rather, the Examiner’s rejection is based on a determination that it would have been obvious to have replaced the particles explicitly disclosed by Henley as useful in forming a gettering layer with deuterium based on Moriceau’s teaching of using deuterium to form microbubbles, the same result achieved by Henley’s particles. Appellant has not explained why the Examiner erred in finding that one of ordinary skill in the art would have had a reasonable expectation of success in using deuterium in Henley’s implanting step to form a gettering layer based on Moriceau’s teaching of equivalence of deuterium and Henley’s particles in forming microbubbles. Because Appellant has not addressed the Examiner’s rationale for rejecting the claims, Appellant has not shown that the Examiner reversibly erred. CONCLUSION Appellant has not identified reversible error in the Examiner’s obviousness determination. The decision of the Examiner rejecting claims 1-4, 6-12, 22, and 23 is affirmed. 7 Appeal 2008-6197 Application 10/908,722 No time period for taking any subsequent action in connection with this appeal maybe extended under 37 C.F.R. § 1.136(a)(1)(iv). AFFIRMED ssl INTERNATIONAL BUSINESS MACHINES CORPORATION DEPT. 18G BLDG. 300-482 2070 ROUTE 52 HOPEWELL JUNCTION, NY 12533 8 Copy with citationCopy as parenthetical citation